Siliconware Precision Industries Co., Ltd.

Wei-Chen Tseng

Chien-Ping Huang

Yu-Ting Lai

A chip carrier for accommodating a passive component is proposed, allowing at least a chip to be electrically connected to the chip carrier. At least a pair of spaced-apart solder pads are formed on the chip carrier in no interference with the electrical connection between the chip and the chip carrier. A passive component is bonded at its two ends onto the solder pads by solder paste that electrically connects the passive component to the chip carrier. A recessed portion formed between the pair of the solder pads, is associated with a bottom surface of the passive component to form a passage, allowing a resin material for encapsulating the passive component or the chip to pass through and fill the passage, whereby the filled passage can prevent bridging of the solder paste and short circuit of the passive component from occurrence, thereby making yield of fabricated products desirably improved.

Chip carrier for accommodating passive component

A semiconductor package structure having universal lead frame and heat sink comprises a chip, a lead frame, a heat sink, a bonding wire, and a molding compound. The leads of the lead frame approaches toward the center portion of the lead frame in order to adapt to various sizes of the chip. The heat sink is mounted on and connected to the leads of the lead frame, and the periphery of the heat sink overlaps the front end of the leads wherein the dimension of the heat sink is not smaller than the size of the chip. The chip is disposed on the heat sink that is also functioned as die pad. The chip is electrically connected to the leads by a bonding wire that is designed to be the shortest. An &ldquo;electrically insulative, and thermally conductive layer&rdquo; is employed for bonding the heat sink to the lead frame. A molding compound is employed to encapsulate the chip, a portion or the whole piece of the heat sink, the leads of the lead frame, and the bonding wires that arc electrically connected between the chip and the leads.

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Fengyuan, Taiwan

Wei-Chen Tseng