Lextar Electronics Corporation

Wei-Chang Yu

Nai-Wei Hsu

Chien-Cheng Chang

Wan-Chun Huang

Pei-Shiu Tsai

Chih-Sheng Hsu

Yi-Ju Chen

A light-emitting element is provided, including a semiconductor structure, a reflective structure, first insulating structures, a conductive structure, and first and second pads. The reflective structure is disposed on the semiconductor structure. The first insulating structure includes first and second insulating portions covering first and second portions respectively, and a gap exposes a third portion between the first and second portions. The conductive structure includes first and second conductive portion. The first conductive portion is disposed on the first insulating portion to contact the semiconductor structure. The second conductive portion is disposed on the second insulating portion to contact the third portion through the gap. The first and second pads are respectively disposed on the first and second conductive portions. Each of the structures below the first and second pads are in flat-type bonding to enhance stress resistance.

Flip-chip light emitting diode with two flat pads

A method of manufacturing a light emitting diode (LED) substrate includes following steps: providing a nano-patterned substrate, which has a plurality of convex portions and a plurality of first concave portions that are spaced apart from each other, wherein each first concave portion has a depth (d1); forming a plurality of protection structures to cover each convex portion, and exposing a bottom surface of each first concave portion; performing an anisotropic etching processing to etch the bottom surface of each first concave portion which is not covered by the protection structure so as to form a plurality of second concave portions having a depth (d2), and d2 is greater than d1.

Light emitting diode substrate

An LED chip is disclosed. The LED chip includes a substrate and a semiconductor element formed on the substrate. A recess is formed on the semiconductor element so as to expose a first-type of semiconductor layer thereof to the environment. The LED chip also includes a conductive layer disposed on a second-type semiconductor layer of the semiconductor element, a first electrode disposed in the recess and electrically connected to the first-type of semiconductor layer, and a second electrode disposed on the conductive layer. In addition, the LED chip includes a first circular electrode disposed on the conductive layer and extending along an edge of the substrate and electrically connected to the second electrode.

Growing community of inventors

Kaohsiung, Taiwan

Wei-Chang Yu