Changxin Memory Technologies, Inc.

Wei Chang

Jiefang Deng

Xiaoguang Wang

Huihui Li

Xiang Liu

Tieh-chiang Wu

Chun-hsiang Chen

Qingsong Du

Zhaohong Lv

Jong Sung Jeon

Yongchang Zhuo

A semiconductor structure and a method for manufacturing a semiconductor structure are provided. The semiconductor structure includes: a substrate; a gate trench located in the substrate; a gate oxide layer located on a side wall and a bottom of the gate trench; and a gate conductive layer located on a surface of the gate oxide layer, a top of the gate conductive layer being lower than a top of the gate trench. The gate oxide layer includes an ion implantation area. A bottom of the ion implantation area is higher than a bottom of the gate conductive layer and lower than the top of the gate conductive layer, and a top of the ion implantation area is higher than or flush with the top of the gate conductive layer.

Semiconductor structure and method for manufacturing semiconductor structure

Embodiments of the present application relate to a resistive memory device and a preparation method thereof. The preparation method includes: providing a base; forming bit line trenches in the base; forming a resistive material layer on a sidewall and the bottom of the bit line trench; and forming a bit line structure in the bit line trench through filling, wherein a variable resistor structure includes the bit line structure and the resistive material layer.

Resistive memory device and preparation method thereof

The present disclosure provides a semiconductor structure, a method of reading data from the semiconductor structure, and a method of writing data into the semiconductor structure. The semiconductor structure includes: a memory matrix, including a plurality of magnetic storage domains arranged in a staggered manner and including a first end, a second end, and an intermediate portion; and a reading and writing circuit, connected to the intermediate portion of the memory matrix and configured to write data into the magnetic storage domains and read data from the magnetic storage domains.

Semiconductor structure, method of reading data from semiconductor structure, and method of writing data into semiconductor structure

A semiconductor structure and the fabrication method thereof are provided. The semiconductor structure includes: a substrate including a first doped region and a second doped region; a first selection transistor and a second selection transistor located in the substrate; a conductive layer located between the first doped region and the second doped region; a resistive dielectric layer located on sidewalls of the conductive layer, where the conductive layer, the first doped region, and a portion of the resistive dielectric layer facing the first doped region constitute a first variable resistor, and the conductive layer, the second doped region, and a portion of the resistive dielectric layer facing the second doped region constitute a second variable resistor; and an isolation dielectric layer located between the conductive layer and the substrate. The semiconductor structure improves the storage density of resistive random access memory (RRAM).

Semiconductor structure and fabrication method thereof

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Hefei, China

Wei Chang