Fih (hong Kong) Limited

Shenzhen Futaihong Precision Industry Co., Ltd.

Wei-Ben Chen

Chao-Hsun Lin

Min Liu

Chao Long Lan

Chang-Hai Gu

Wu-Zheng Ou

Xiao-Kai Liu

A housing includes a metal base and a non-conductive member. The metal base has an internal surface and a plurality of gap. The non-conductive member covers at least a portion of the internal surface of the metal base, and the non-conductive member is formed on the bottom of the at least one gap. The metal base is spaced by the gaps to form a plurality of metal sheets and at least one main body. Each gap is completely filled with one dielectric member. The metal sheets and the at least one main body are all bonded with the dielectric member and are electrically isolated with each other.

Housing and electronic device using the same

A method of making a housing includes providing a substrate having an opening, providing a plurality of metal sheets, providing a plurality of non-conductive members, and bonding the metal sheets together through the non-conductive members, forming a metal sheets member, placing the metal sheets member in the opening, bonding the metal sheets member with the substrate through the non-conductive members, and removing excess parts of the substrate to form the housing.

Method for making housing

A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of non-conductive members, the metal sheets are bonded with each other through non-conductive members, forming a metal sheets member, the metal sheets member is located in the opening, the metal sheets member is bonded with substrate through the non-conductive members.

Housing, electronic device using same, and method for making same

Growing community of inventors

Taipei, Taiwan

Wei-Ben Chen