Taiwan Semiconductor Manufacturing Comp. Ltd.

Wei-An Tsao

Jing-Cheng Lin

Szu-Wei Lu

Cheng-Lin Huang

Tsung-Fu Tsai

Yi-Jung Chen

A semiconductor package includes a first integrated circuit, a plurality of first through vias and a plurality of fin-shaped through vias. The first through vias surround the first integrated circuit. The fin-shaped through vias are physically connected to the first through vias respectively, wherein the first through vias are disposed between the first integrated circuit and the fin-shaped through vias.

Semiconductor packages

An embodiment method of forming and a bump structure are disclosed. The bump structure includes a passivation layer formed over a metal pad, the passivation layer having a recess exposing a portion of the metal pad, and a metal bump formed over the metal pad, the metal bump having a lip extending beneath the passivation layer, the lip anchoring the metal bump to the passivation layer.

Growing community of inventors

Yuanlin, Taiwan

Wei-An Tsao