Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies IP (singapore) Pte. Ltd.

Avago Technologies General IP Pte, Ltd.

Avago Technologies Ecbu IP Pte. Ltd.

Avago Technologies Fiber IP Pte Ltd.

Wee Sin Tan

James Costello

Yufeng Yao

Rani Ramamoorthy Saravanan

Kuldeep Kumar Saxena

Peng Yam Ng

Pak Hong Yee

Cherng Woei Heng

Sin Heng Lim

Kai Koon Lee

Chi Boon Ong

Jing Zhang

Sze Ping Ong

Deng Peng Chen

Serene Seok Peng Chan

Tammy Siew Hoon Ho

Chee Kien Lim

Boon How Kok

Chi-Boon Ong

Hui Ling Neo

Junhua He

Teck Chai Goh

Serene Chan

John Lim Ngee Loong

Basoor Suresh

Sanjay Krishnan

Saravanan Rani Ramamoorthy

Ramana-V Pamidighantam

Freddy Ka Hui Ho

John Lim

Josephine Pei Chen Quek

Soon Lee Tan

An optical sensor, optical system, and proximity sensor are disclosed. An illustrative proximity sensor is disclosed to include a light source, a photodetector including a photo-sensitive area that receives incident light and converts the received incident light into an electrical signal, and a plurality of polarization layers stacked on the photodetector that limit light from becoming received incident light for the photo-sensitive area to light traveling toward the photodetector along a predetermined path.

Polarizer structure to control crosstalk in proximity sensor including a cover physically separates a photodetector from an object

Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising sidewalls, a first recess, a second recess, a partitioning divider disposed between the first and second recesses, and an overlying shield comprising an infrared-absorbing material. The transmitter die is positioned in the first recess, and the receiver die is positioned within the second recess. The partitioning divider comprises liquid crystal polymer (LCP) such that the partitioning divider and the infrared-absorbing material of the shield cooperate together to substantially attenuate and absorb undesired infrared light that might otherwise become internally-reflected within the housing or incident upon the receiver as a false proximity or object detection signal.

Infrared proximity sensor package with improved crosstalk isolation

A proximity sensing device having an emitter die, a receiver die, a body is disclosed. The proximity sensor has an optical structure provided on the body. The optical structure may provide an optical path to allow radiation reflected by a near object that may be otherwise blocked by the body to be transmitted towards the receiver die. In addition to the proximity-sensing device, a sensing device having at least two trenches that allow close proximity sensing is disclosed. A method for sensing an object that involve determining whether the object correspond to a near object or a far object is presented.

Proximity-sensing device

An optical sensor for detecting at least one of proximity and gesture is disclosed. The optical sensor is configured to detect or sense an object that is located out of the sensor's primary axis. This off-axis detection is facilitated by projecting light emitted by a light source away from the sensor's primary axis and away from the direction in which the light was originally emitted by the light source. The light detector is also configured to detect the light that is being projected off-axis.

Off-axis detection for proximity or gesture sensor

In one embodiment, an optical device comprising an emitter, first and second emitter optical elements and a receiver is disclosed. The emitter and the receiver may be arranged substantially along a longitudinal axis. The first and second emitter optical elements may be interposing the longitudinal axis. One other embodiment discloses an optical device comprising an emitter and a receiver arranged on a longitudinal axis. The optical device may further comprise first and second emitter optical elements arranged along an axis orthogonal to the longitudinal axis but interposing the longitudinal axis. In another embodiment, a proximity sensor having first and second emitters interposing a longitudinal axis is disclosed.

Optical device with reduced crosstalk

An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a gap. Layers of infrared opaque, attenuating or blocking material are disposed on at least some of the external surfaces forming the gap to substantially attenuate or block the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimize optical crosstalk and interference between the light emitter and the light detector.

Infrared attenuating or blocking layer in optical proximity sensor

A proximity sensor device, which may detect the presence of external objects at close proximity is disclosed. The proximity sensor device may comprise an emitter, a detector, a separation wall and an internal channeling section. In one embodiment, the internal channeling section may be configured to direct light from the emitter to the detector when the external object is present at close proximity. In other embodiments, a proximity sensor assembly, an optical structure and an electronic device having similar internal channeling section are disclosed.

Proximity sensor device with internal channeling section

An optical proximity sensor and housing for the same are disclosed. The housing is provided with at least two support structures and at least two modules. A first of the support structures transfers vertical forces applied to one end of a module to an opposite end of the opposite module. A second of the support structures inhibits a pivoting of the modules about the first support structure.

Housing for optical proximity sensor

An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a substantially optically non-transmissive infrared light barrier component. The infrared light barrier component substantially attenuates or blocks the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimizes optical crosstalk and interference between the light emitter and the light detector.

Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components

A proximity sensor includes a printed circuit board (PCB); a first cup and a second cup embedded in the PCB; an electromagnetic radiation transmitter operably mounted in the first cup; and an electromagnetic radiation receiver operably mounted in the second cup.

Proximity sensor

Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board ('PCB') substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components.

Compact optical proximity sensor with ball grid array and windowed substrate

A proximity sensor device is provided in compact unit that has the ability to sense or monitor in different directions, such as sensing or monitoring in both the vertical and horizontal directions. Methods are also provided. In an illustrative embodiment, the proximity sensor device includes a first transmitting/receiving pair and a second transmitting/receiving pair on a printed circuit board along with an IC to control the transmitters and receivers, as well as, in some embodiments, to provide signal filtering, amplification or other desired features.

Compact multi-direction proximity sensor device and method

Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

Optical proximity sensor package with lead frame

An optical proximity sensor is provided that comprises an infrared light emitter operably connected to and driven by a light emitter driving circuit and a light detector operably connected to and driven by a detector sensing circuit. A metal housing or shield formed of metal and comprising first and second apertures surrounds the light emitter and the light detector such that at least a first portion of light emitted by the light detector passes through the first aperture, and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second aperture for detection by the light detector. The metal housing or shield further comprises first and second modules within which the light detector and light detector are disposed, respectively. The first and second modules comprise adjoining optically opaque metal inner sidewalls that provide optical isolation between the first and second modules, where the first and second inner sidewalls are separated from one another by at least one metal tab foldably disposed therebetween. The at least one metal tab is configured to transfer a vertical force applied to one end of one module to an opposite end of the other module.

Metal shield and housing for optical proximity sensor with increased resistance to mechanical deformation

Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, a light emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

Growing community of inventors

Singapore, Singapore

Wee Sin Tan