Intel Corporation

Wee Hoe

Eng Huat Goh

Khang Choong Yong

Ping Ping Ooi

Siang Yeong Tan

Mooi Ling Chang

Chee Chun Yee

Chan Kim Lee

Say Thong Tony Tan

Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

A semiconductor device and associated methods are disclosed. In one example, a processor die is coupled to a first side of a package substrate, and a memory die coupled to a second side of the package substrate. A system accelerator die is further coupled to the package substrate. In selected examples, the system accelerator die provides performance improvements, such as higher cached memory speed and/or higher memory bandwidth.

Compact semiconductor chip system and method

Integrating system in package (SIP) with input/output (IO) board for platform miniaturization

Techniques for serial interface charging are described. An apparatus may comprise, for example, a serial interface such as a thunderbolt interface and a charger control circuit coupled to the serial interface, the charger control circuit arranged to operate in a charging mode or an on-the-go (OTG) mode based on information received from the serial interface. Another apparatus may comprise, for example, a serial interface such as a thunderbolt interface and a charger circuit coupled to the serial interface, the charger circuit arranged to operate in a first charging mode or a second charging mode based on information received from the serial interface, the information comprising characteristics of a device coupled to the serial interface. Other embodiments are described and claimed.

Techniques for serial interface charging

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Bayan Lepas, Malaysia

Wee Hoe