Utac Headquarters Pte. Ltd.

Wedanni Linsangan Micla

Hua Hong Tan

Rui Huang

Nathapong Suthiwongsunthorn

Kriangsak Sae Le

Roel Adeva Robles

Antonio Jr Bambalan Dimaano

Beng Yeung Ho

Nelson Agbisit De Vera

Dennis Fernandez Tresnado

Allan Pumatong Ilagan

Teddy Joaquin Carreon

Chee Kay Chow

Enrique Jr Sarile

Ming Koon Ang

Thian Hwee Tan

Mauro Jr Dionisio

Kian Soo Lim

Mario Arwin Simon Fabian

Mario Arwin Fabian

Antonino Ii Milanes

Semiconductor packages and methods for forming thereof are disclosed. The semiconductor package includes a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The cover adhesive may serve as a standoff structure to support the protective cover. The standoff structure may be configured to form multiple cavities below the protective cover to reduce thermal stress on the protective cover. An encapsulant is disposed to cover the package substrate while leaving the top package surface exposed.

Reliable semiconductor packages

A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces. An encapsulant is disposed on the package substrate to cover exposed portions of the package substrate, die and bond wires and side surfaces of the protective cover, while leaving the first major cover surface exposed. The discontinuity enhances adhesion of the encapsulant to the protective cover.

Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a wafer having first and second major surfaces. The wafer is prepared with a plurality of dies and a plurality of external electrical contacts disposed on the first major surface of the wafer. The method includes processing the wafer. Processing the wafer includes separating the wafer into a plurality of individual dies. An individual die includes first and second major surfaces and first and second sidewalls, and the external electrical contacts are formed on the first major surface of the die. An encapsulant material is formed. The encapsulant material covers at least a portion of the first and second sidewalls of the die.

Semiconductor packages and methods of packaging semiconductor devices

Growing community of inventors

Singapore, Singapore

Wedanni Linsangan Micla