Agere Systems Inc.

Wayne Rademacher

Philip William Seitzer

James C Golden

Steven V Stang

Calvin Lee Schumacher

Brian Lee Buss

Robert Dale Ickes, Jr

A method of electrical testing devices such as integrated circuits that include conductive pads formed on the surface. A material having a desired bulk resistivity and viscosity is applied to either the device or the electrical probe prior to testing. The application of the material has been found to substantially reduce the need for cleaning of the probe.

Method of electrical testing of an integrated circuit with an electrical probe

Method of electrical testing

A cantilever probe method of parametrically testing wafers extends the probe tip cleaning interval, maintains relatively low contact resistance, and reduces contact resistance variability. In one embodiment of our invention, a method of testing electronic circuits formed in a wafer having lead-free terminals, comprises the steps of exposing the terminals to a plasma containing oxygen; providing a test apparatus having cantilevered probes for contacting the terminals; each probe having a cantilevered probe arm and a BeCu probe tip extending from the arm at an acute angle &#x3b1;; the angle &#x3b1; being designed to essentially eliminate sliding movement of the probe tip when in contact with a terminal; and bringing the probe tips into contact with selected ones of the terminals, so as to perform electrical tests on the wafer; and, during the contacting step, exposing the probe tips to a flow of a non-oxidizing gas (e.g, nitrogen, argon). In a preferred embodiment, the terminals are Sn-based solder bumps. In another preferred embodiment the angle &#x3b1; is approximately 87&#xb0;&#x2013;90&#xb0;.

Method of testing electronic wafers having lead-free solder contacts

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Jordon, MN, United States of America

Wayne Rademacher