Other

Plastronics Socket Partners, Ltd.

Thermalloy, Inc.

Plastronics, Inc.

Plastronics Interconnections, Inc.

Wayne K Pfaff

David W Pfaff

Golf putter head tool

Golf course sign

Golf putter head with self-adjusting face

Golf putter head with adjustable face

Golf swing plane alignment tool

Golf club shaft strap for audible swing feedback

Golf putter head with tubular hollowed area for spring loaded pin

Golf putter attachment to aid in alignment of putt

Golf putter attachment to give feedback of miss-hit putt

Golf headstrap for plumb bob alignment

Golf putter head with spring loaded mallet

Ball grid array devices are mounted inaburn-in and testsocket which has a top surfacesockets which have top surfaceswith windows for theball terminalsterminal ballsdepending from the ballgradgridarray device. Contact fingers mounted on the base of the socket extend through a bending plate and into the windows from the opposite side of the top surface. When the bending plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with theball terminalsterminal balls. The ends of the contact members are urged into contact with theball terminalsterminal ballsbetween the center of theballterminal balland the surface of the ball grid array device, thus retaining the device in the socket.

Mounting apparatus for ball grid array device

A simple, inexpensive burn-in and test mounting for high terminal density grid array packages is formed by a support base which carries a plurality of C-shaped spring finger contacts. One end of each spring finger contact is attached to the first face of the support base at the edge of a hole corresponding to the outline of the LGA package and extends through the hole. The contacts are curved so that the second end of each contact is supported above and spaced from the opposite side of the support base. Each spring finger is curved to define a knee which lies in a plane parallel with the faces of the support base. The spring fingers are arranged so that the knees are in register with lands on an LGA package. When the LGA package is moved toward the support base, the knees contact the lands on the LGA package. Electrical communication may be established with either end of the finger, thus permitting spreading of input/output terminal connections.

Test mounting for grid array packages

A test mounting for LGA packages uses curved contact fingers to make electrical contact between lands on the LGA package and surface mount circuitry on a circuit board or the like. The mounting includes a guide member with guide apertures therein spaced from a support base with corresponding guide apertures. A bending plate positioned between the guide plate and the support base is moved laterally with respect thereto to increase or decrease the distance between the ends of each contact finger and thereby connect or disconnect the ends of the contact fingers with an LGA package mounted adjacent the guide plate and circuit pads on a circuit board on which the test mounting is mounted.

Test mounting for surface mount device packages

Test and/or burn-in sockets for high frequency electronic device packages are formed using contact pins having parallel ends joined by a support beam supported so that one end of the pin extends through a guide into a cavity in the socket and the other end extends through a second guide displaced from the first guide. The outer ends of the contact pins are arranged to contact input/output lands of a external circuitry such as a burn-in board or the like and the inner ends arranged to contact input/output leads or lands on an electronic LGA package. The end portions of the contact pins are constrained in parallel guides which are arranged to precisely align the ends of the pins with the terminal lands and the length and size of the contact pins are minimized to minimize signal distortion.

Mounting for high frequency device packages

Growing community of inventors

Irving, TX, United States of America

Wayne K Pfaff