Onto Innovation Inc.

Rudolph Technologies, Inc.

Rudoplh Technologies, Inc.

Wayne Fitzgerald

J Casey Donaher

Christopher J McLaughlin

John Thornell

Chetan Suresh

Jian Lu

Xin Song

Keith Frank Best

Wu Y Han

Elvino Da Silveira

Gurvinder Singh

A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

System and method for optimizing a lithography exposure process

A method for monitoring and controlling a substrate singulation process is described. Device edges are imaged and identified for analysis. Discrepancies in device edges are noted and used to modify a singulation process and to monitor the operation of singulation processes for anomalous behavior.

Wafer singulation process control

Concepts presented herein relate to approaches for performing substrate inspection. In one aspect, the concepts relate to detecting anomalies or candidate defects on the substrate based on contrast in images obtained of the substrate.

Inspection of substrates

Semiconductor device inspection of metallic discontinuities

Growing community of inventors

Andover, MA, United States of America

Wayne Fitzgerald