Gte Communication Systems Corporation

Gte Automatic Electric Incorporated

Gte Automatic Electric Laboratories Incorporated

Wayne E Neese

William E Stepan

Robert F Janninck

Thomas D Belanger, Jr

Charles K Kubik

George S Lychyk

A fastener and receptacle arrangement is utilized to perpendicularly connect two pieces of flat stock material together. One piece of flat stock material includes a hole for insertion of the fastener and the other piece includes an opening for mounting a receptacle. The receptacle is secured to that board by a flexible member of the board which engages a recess in the receptacle. The piece of flat stock material with the receptacle secured to it is then perpendicularly secured to the other piece of flat stock material by a fastener which passes through that other piece of flat stock material and fixably engages the receptacle.

Fastener and receptacle arrangement for perpendicularly connecting

An arrangement for constructing multi-layered printed circuits characterized by a first layer having top and bottom surfaces with the top surface including a plurality of parallel conductors divided into at least two conductor groups by a transversely oriented break across each conductor. The bottom surface further includes a plurality of parallel conductors arranged perpendicular to the conductors on the top surface and is also divided into at least two conductor groups by a transversely oriented break across each conductor. A plurality of holes extend through the first layer with, each hole adjacent to an intersecting conductor pair. A second layer including top and bottom surfaces and a plurality of plated-through holes has conductor pennants extending from selected holes in a first direction on the top surface and a second opposite direction on the bottom surface. A plurality of first and second layers are sandwiched together, with each hole of each layer in registration with the other and each conductor pennant contacting a respective first layer conductor. Conductor segments printed on the second layer top and bottom surfaces interconnect selected conductors between respective conductor groups. Additionally, two or more second layers are interconnected by via pins extending through the arrangement.

High density multi-layer circuit arrangement

A device arranged to electrically connect and physically attach a hybrid circuit module to a printed wiring card. The device is characterized by a male terminal section arranged to be mounted on a printed wiring card, a compliant section for buffering any flexure or displacement imparted to the hybrid circuit module and a hybrid circuit module accepting section. Additionally, a terminal accepting section is provided disposed to accept the male terminal section of another similar device, allowing the stacking of a plurality of hybrid circuit modules to the printed wiring card.

Contact terminal device for connecting hybrid circuit modules to a

An improved screen printing apparatus for printing conductive, resistive and insulative films to the surfaces of ceramic or glass substrates. The screen printing apparatus is characterized by a carriage having a substrate to be printed resting thereon and a frame member extending about the periphery of the carriage. A mesh screen having an emulsion layer is affixed to the screen and suspended over the substrate. The improvement comprising a pair of force absorbing members attached to the carriage in a space relationship to and on opposite sides of the substrate. A pair of rolling means are attached to opposite sides of a squeegee holder with each rolling means in registration with a respective force absorbing surface. A squeegee extends from a bottom surface of the squeegee holder intermediate the rolling means. As the squeegee holder is drawn across the screen each rolling means travels along a respective force absorbing member.

Thick film screen printing apparatus

A device is disclosed for mounting, interconnecting and terminating printed circuits. The invention comprises a frame of insulating material including a fixed printed circuit substrate and an area for supporting and confining a removable printed circuit substrate. A connector molded on one end of the frame extends input/output signals to both substrates. A handle molded on a second end of the frame includes slots through which clips are inserted electrically interconnecting the two substrates. The clips also aid in retaining the removable circuit substrate to the frame.

Device for mounting, interconnecting and terminating printed circuits

A device is disclosed for mounting, interconnecting and terminating printed circuits. The invention comprises a frame of insulating material arranged to support, position and confine two printed circuit substrates. A connector molded on one end of the frame extends input/output signals to both substrates. A handle molded on a second end of the frame includes slots through which clips are inserted electrically interconnecting the two substrates. The clips also aid in retaining both substrates to the frame.

Printed circuit connecting device

A device for selectively connecting a plurality of circuit elements in a thick/thin film circuit comprising, a pivot pin mounted to the film circuit and a manually rotatable contact element mounted to the pin. Contact fingers emanating from the contact element communicate with contact pads connecting a different set of film circuit elements together each time the contact element is rotated.

Electrical switch for thick/thin film circuits

Switching device for thick/thin film circuits

An arrangement for mounting a dual-in-line packaged integrated circuit (DIP) to a thick/thin film circuit wherein a portion of each DIP lead is formed into a U-shape including a horizontal foot portion. The arrangement further includes a complementary socket which accepts the U-shaped DIP leads in opposite sides thereof. The socket is then soldered to either a thick/thin film circuit of a circuit board.

Arrangement for mounting dual-in-line packaged integrated circuits to

A method for forming a film resistor for hybrid circuits trimmable from 0 ohms to infinite resistance, whereby resistive material is deposited over previously applied conductive material. One edge of the resistor material is flush with one edge of the conductor path and the resistor material extends beyond the opposite side of the conductor path. The resistor is trimmed to value by a laser or mechanically abrading a slot in its center perpendicular to the conductor by simultaneously removing a portion of both conductor and resistive material.

Method for forming universal film resistors

A machine for assembling the plural contact pairs of a multi-element reed capsule switch inside of a glass envelope and maintaining the overall assembly in alignment while the glass envelope is heated and sealed around the terminal ends of the contact pairs. Plural pairs of the reed switch contact members and the glass envelope are manually assembled into intermediate loading fixtures. The machine then automatically transfers the contact members and glass envelope to chucks for maintaining them in correct alignment; the chucks position the contact members inside of the glass envelope; the machine pressure chamber closes and is rapidly evacuated of atmosphere, flushed, and pressurized with an inert gas and the glass sealed about the contacts all while maintaining the correct alignment.

Growing community of inventors

Hoffman Estates, IL, United States of America

Wayne E Neese