The State University of New York

Leidos, Inc.

Crysta-lyn Chemical Company, Inc.

The Research Foundation of State

Wayne E Jones

Bahgat Ghaleb Sammakia

William E Bernier

Junghyun Cho

Kenneth H Skorenko

Scott Oliver

Ganesh Subbarayan

Jian Qiang Liu

Jared B DeCoste

Megan Fegley

Bradley Galusha

Julia B Tollin

Francis D Goroleski

Danielle McCarthy

Emilly Obuya

Nicholas A Ravvin

Mixed-phase TiOnanofibers prepared via a sol-gel technique followed by electrospinning and calcination are provided as photocatalysts. The calcination temperature is adjusted to control the rutile phase fraction in TiOnanofibers relative to the anatase phase. Post-calcined TiOnanofibers composed of 38 wt % rutile and 62 wt % anatase exhibited the highest initial rate constant of UV photocatalysis. This can be attributed to the combined influences of the fibers' specific surface areas and their phase compositions.

Metal oxide nanofibrous materials for photodegradation of environmental toxins

Compositions for increasing the thermal stability of optical absorbers are provided as well as methods of making and using the resulting compositions. The compositions or complexes of the present teachings generally include an optical absorber bound to a metal or a metal oxide through one or more linkers, which contain a metal binding moiety.

Increased thermal stabilization of optical absorbers

Embodiments of films and material layers comprising PEDOT. These embodiments are the result of methods that utilize polymerization processes including vapor phase polymerization (VPP) to form the conductive film comprising PEDOT. In one embodiment, the film can result from a method that includes steps for depositing a coating solution onto a substrate, exposing the substrate to a monomer source, and cleaning the substrate after polymerization. The coating solution can comprise an initiating oxidant, which facilitates growth of PEDOT from 3,4 ethylenedioxythiophene (EDOT), as well as a quenching agent that neutralizes acid that results from polymerization.

Conductive films and devices comprised thereof

A method for coating for a substrate, comprising applying an underlayer of a self assembling monolayer well ordered array of long chain molecules on the substrate; and applying a top layer, over the underlayer, wherein the self-assembling monolayer well ordered array serves as a molecular template organizing formation of said top layer, comprising at least one of a thermally-resistant polymer layer over said self assembling monolayer selected from the group consisting of epoxies, and phosphorus-based polyimides; and a metal oxide, metal nitride, or a ceramic. The self assembling monolayer may be selectively applied to a portion of the substrate, leaving an uncoated region, and the top layer formed only over the areas of the substrate coated with the self-assembling monolayer, resulting in at least one region of the substrate which is not coated with the top layer.

Surface coating for electronic systems

The present invention features additions of nanostructures to interconnect conductor particles to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nanostructures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.

Nano-structure enhancements for anisotropic conductive material and thermal interposers

The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.

Nano-structure enhancements for anisotropic conductive adhesive and thermal interposers

A bi- or multi-layer coating is deposited upon a substrate using a low temperature process. The bi-layer is a lower layer of a SAM coating, which is overlaid with a hard coating. The hard coating can be made of materials such as: polymer, SiN, BN, TiN, Si0, Al0, Zr0, YSZ, and other ceramic materials, and the underlying, compliant, SAM coating can comprise substances containing long chain molecules that chemically bond to the substrate. This bi-layer provides both environmental and hermetical protection to electronic hardware and MEMS systems, without employing expensive packaging materials and processes. Multiple bi-layers may be combined to form multi-layer coatings. A protective polymer or other material may optionally be formed as an outside layer.

Method of manufacturing surface coatings for electronic systems

A bi- or multi-layer coating is deposited upon a substrate using a low temperature process. The bi-layer is a lower layer of a SAM coating, which is overlaid with a hard coating. The hard coating can be made of materials such as: polymer, SiN, BN, TiN, SiO, AlO, ZrO, YSZ, and other ceramic materials, and the underlying, compliant, SAM coating can comprise substances containing long chain molecules that chemically bond to the substrate. This bi-layer provides both environmental and hermetical protection to electronic hardware and MEMS systems, without employing expensive packaging materials and processes. Multiple bi-layers may be combined to form multi-layer coatings. A protective polymer or other material may optionally be formed as an outside layer.

Growing community of inventors

Vestal, NY, United States of America

Wayne E Jones