Thomson Components-mostek Corporation

Mostek Corporation

Wayne A Mulholland

Robert Henry Bond

Michael A Olla

Jerry S Cupples

Barbara R Mozdzen

Linda S Wilson

Daniel J Quinn

Linn C Garrison

Steven Swendrowski

Robert J Martin

Quinn, Daniel J

David S Wilson

Ilya L Tsitovsky

Carlos Esparza, Jr

Charles F Held

Yen T Nguyen

A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.

Integrated-circuit leadframe adapted for a simultaneous bonding operation

An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.

Process of forming integrated circuits with contact pads in a standard

A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.

Automatic assembly of integrated circuits

Socket for housing a plurality of integrated circuits

Growing community of inventors

Plano, TX, United States of America

Wayne A Mulholland