Marvell International Limited

Marvellworld Trade Ltd.

Wayne A Loeb

David M Signoff

Ming He

King Chun Tsai

Renaldi Winoto

Li Lin

Alireza Shirvani-Mahdavi

Shu-Hsien Liao

Randy Tsang

Huahung Kao

Tyson Leistiko

Chun-Geik Tan

Kedar Shirali

Sang Won Son

Jinho Park

Yuan Lu

Xinhua Chen

Alireza Shrivani-Mahdavi

Sang Wong Son

A circuit includes a bias circuit for a biased transistor. The bias circuit includes a master-slave source follower circuit, a reference transistor, and a bias circuit voltage output coupled to the biased transistor and configured to provide a bias voltage. The reference transistor has a transconductance substantially identical to a transconductance of the biased transistor. A signal ground circuit may be coupled between the biased transistor and one or more components of the bias circuit that do not generate significant return currents to a power supply ground. A method includes generating a current in a reference transistor according to a first voltage generated using a master source follower circuit, generating a second voltage substantially identical to the first voltage using a slave source follower circuit, and providing the second voltage to a biased transistor. The reference transistor has a transconductance substantially identical to a transconductance of the biased transistor.

Memory effect reduction using low impedance biasing

Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting a packaging type for an integrated circuit. A structure generally includes a bump pad having a plurality of electrically disconnected bump pad sections, a plurality of bond pads each configured for electrical connection to one of the bump pad sections, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the one bump pad section. A method generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. Another method generally includes forming the uppermost metal layer, and forming either a wire bond to at least one of the bond pads, or a ball bond or solder ball to electrically connect the bump pad section.

Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types

An amplifier biasing circuit that reduces gain variation in short channel amplifiers, an amplifier biasing circuit that produces a constant Gm biasing signal for short channel amplifiers, and a multistage amplifier that advantageously incorporates embodiment of both types of amplifier biasing circuits are described. Both amplifier biasing circuit approaches use an operational amplifier to equalize internal bias circuit voltages. The constant Gm biasing circuit produces a Gm of 1/R, where R is the value of a trim variable resistor value. The biasing circuit that reduces gain variation produces a Gm of approximately 1/R, where R is the value of a trim variable resistor value, however, the biasing circuit is configurable to adjust the bias circuit Gm to mitigate the impact of a wide range of circuit specific characteristics and a wide range of changes in the operational environment in which the circuit can be used, such as changes in temperature.

Reduced gain variation biasing for short channel devices

Apparatus, systems, and methods implementing techniques for calibrating a filter circuit. A comparator generates an output based on a filter output amplitude signal and a reference amplitude signal. A calibration logic unit receives the comparator output and produces a component code that is used by the filter circuit to adjust one or more component values.

Iterative filter circuit calibration

In one embodiment, an apparatus includes a first reference voltage coupled to a first metal layer and a second reference voltage coupled to a second metal layer. A first finger type in the plurality of fingers is coupled to the first metal layer at a first area and coupled to the first metal layer and the second metal layer at a second area. A second finger type in the plurality of fingers is coupled to the second metal layer at the first area and coupled to the first metal layer and the second metal layer at the second area. Also, the first finger type and the second finger type alternately positioned next to each other.

Ground shield capacitor

Systems and methods for power amplification using multiple digital amplifiers are provided. A power amplifier includes a first digital amplifier configured to process a digital input signal to generate a first analog output signal. The first analog output signal is configured to have a magnitude corresponding to amplitude information of the digital input signal. The power amplifier further includes a second digital amplifier configured to process an adjusted digital input signal to generate a second analog output signal. The second analog output signal is configured to have a magnitude corresponding to amplitude information of the adjusted digital input signal. An adjustment module configured to adjust amplitude information and phase information of the digital input signal generates the adjusted digital input signal. The digital input signal is adjusted to control a relationship between the first analog output signal and the second analog output signal.

Digital power amplifier

In accordance with an embodiment of the disclosure, systems and methods are provided for multi-modal power amplification. In certain implementations, an adjustable power amplifier amplifies an input signal, and the amount of amplification is varied based on the input signal. A variable impedance unit receives an amplified input signal, and the amount of load impedance at the variable impedance unit is varied based on the input signal.

Systems and methods for performing multi-modal power amplification

A transceiver including a filter, a transmitter, a receiver, a measurement module and a gain module. The filter is configured to (i) receive an input signal, and (ii) filter the input signal to generate an output signal. The transmitter is configured to transmit the output signal based on (i) a gain of the transmitter, and (ii) a power output of the transmitter. The receiver is configured to receive the output signal, where the output signal is fed back from the transmitter to the receiver. The measurement module is configured to, based on the output signal, generate a linearity signal, where the linearity signal is indicative of the linearity of the transmitter. The gain module is configured to, based on the linearity signal, adjust the gain of the transmitter to maximize the power output of the transmitter. The filter is configured to filter the input signal based on the linearity signal.

Method and apparatus for maximizing power output based on linearity of a transmitter

Disclosed is a transmit/receive circuit arrangement wherein a transceiver circuit including a transmit/receive switch is fabricated on an integrated circuit chip. A matching network is wholly disposed off-chip relative to the integrated circuit chip. In embodiments, at least a portion of the matching network is formed off-chip and a portion of the matching network is formed on-chip.

RF front-end with integrated T/R switch

A system including a power amplifier having a first gain, a preamplifier having a second gain, a first temperature sensor configured to sense the temperature of the power amplifier, and a bias generator. The first gain is a function of a temperature of the power amplifier. The preamplifier receives an input signal, amplifies the input signal according to the second gain, and outputs an amplified signal to the power amplifier. The bias generator generates a biasing signal to bias the preamplifier and adjusts the second gain of the preamplifier by adjusting the biasing signal based on the temperature of the power amplifier and an ambient temperature. The adjusted second gain of the preamplifier compensates a change in the first gain of the power amplifier due to a change in the temperature of the power amplifier.

Cancellation of gain change due to amplifier self-heating

Methods and devices provide for power amplification in a push pull power amplifier. A circuit comprises an input stage, a power amplifier stage and an output stage. The input stage provides a plurality of control voltages based on a control current. The input stage may include a transformer with a primary side and two secondary sides. A power amplifier stage comprises an NMOS transistor and a PMOS transistor arranged in a push-pull configuration to generate a plurality of amplified signals. The transistors may be in a common gate arrangement. The output stage combines the amplified signals and generates an output voltage. The output stage may include a transformer with two primary sides and a secondary side.

Methods and devices for folded push pull power amplifiers

An amplifier biasing circuit that reduces gain variation in short channel amplifiers, an amplifier biasing circuit that produces a constant Gm biasing signal for short channel amplifiers, and a multistage amplifier that advantageously incorporates embodiment of both types of amplifier biasing circuits are described. Both amplifier biasing circuit approaches use an operational amplifier to equalize internal bias circuit voltages. The constant Gm biasing circuit produces a Gm of 1/R, where R is the value of a variable resistor value. The biasing circuit that reduces gain variation produces a Gm of approximately 1/R, where R is the value of a variable resistor value, however, the biasing circuit is configurable to adjust the bias circuit Gm to mitigate the impact of a wide range of circuit specific characteristics and a wide range of changes in the operational environment in which the circuit can be used, such as changes in temperature.

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San Francisco, CA, United States of America

Wayne A Loeb