Honeywell International Inc.

Honeywell G.m.b.h.

Wayne A Lamb

Lamar Floyd Ricks

Joel D Stolfus

Peter A Schelonka

Curtis B Johnson

Greg R Furlong

Lawrence E Frazee

Alistair David Bradley

Ryan Jones

Peter G Hancock

Kent E Van Ostrand

Kenneth V Bechtold

Scott E Michelhaugh

Marsha Martin

John S Patin

Lamap F Ricks

Shaun Cinnamon

A method of incorporating compliant pins in a pressure sensor that uses PCB (printed circuit board) and is press fitted into the compliant pins. The compliant pins are made in the leadframe and the leadframes are molded into the plastic housing. The PCB is press fitted to the leadframe/housing assembly.

Pressure sensor incorporating a compliant pin

A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

Chip on lead frame for small package speed sensor

A pressure sensor apparatus and a method of forming the same. A substrate (e.g., PCB) can be provided that includes a top side and a bottom side. A pressure transducer can be directly bonded to the top side of the substrate, wherein the substrate comprises substrate walls forming a plated through-hole that allows for the passage of a sensed media to contact a back side of the pressure transducer. Thereafter, a metal carrier with an integral port is bonded to the bottom side of the substrate, thereby forming a chip-on-board pressure sensor in which the need for a plating or coating to allow adhesion between the pressure transducer and the metal carrier is eliminated. The pressure transducer may comprise, for example, silicon or silicon bonded to glass. The metal carrier can be provided with a feature that mates with a valve such as a Schrader valve.

Pressure sensor method and apparatus

A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

Thermoplastic overmolding for small package turbocharger speed sensor

A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

Magnet orientation and calibration for small package turbocharger speed sensor

A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Multiple output magnetic sensor

Angular position sensing apparatuses and methods are disclosed. An angular position sensing apparatus can include a rotatable base and two or more magnets located proximate to one another upon the rotatable base. The magnets are generally magnetized parallel and opposite to one another to create a uniform magnetic field thereof. Additionally, a sensor can be located external to the two magnets, such that the sensor comes into contact with the uniform magnetic field to sense a change in angular position associated with the rotatable base.

Magnetic angular position sensor apparatus

A geartooth sensor utilizes an algorithm for establishing an adaptive threshold for the switch point of the sensor to minimize drift in the point at which the sensor output changes in relation to the target features it is tracking. The algorithm utilizes measured waveform peak and average outputs and applies a separate empirically derived constant to each value to quickly obtain the major portion of the adaptive threshold value from the product of the first constant and the peak output, and to refine the threshold value further with the product of the second constant and the average output.

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Freeport, IL, United States of America

Wayne A Lamb