Screen Holdings Co., Ltd.

Wataru Yano

Akio Hashizume

Takashi Shinohara

Nobuyasu Hiraoka

Takayuki Nishida

Katsunori Tanaka

Disclosed is a substrate treating method for performing cleaning treatment to a substrate by contacting a brush against the substrate. The method includes a rotating step of rotating a spin holder, holding the substrate, around a vertical shaft axis, an outer periphery edge contacting step of contacting the brush against the substrate at an outer periphery edge contacting position closer to an outer periphery edge of the substrate than to the shaft axis while the substrate is rotated in a horizontal plane, a first moving step of moving the brush from the outer periphery edge contacting position to a side adjacent to the shaft axis while the brush is brought into contact against the substrate, and a second moving step of moving the brush from the side adjacent to the shaft axis toward the outer periphery edge after the first moving step.

Substrate treating method and substrate treating apparatus

A substrate cleaning brush for cleaning a wafer includes a brush main body, a brush holding unit, and a main flow path forming body. The brush main body has a liquid permeable structure and includes a lower surface that comes into contact with a substrate. The brush holding unit holds the brush main body while exposing a distal end portion in a vertical direction of the brush main body to the outside. The main flow path forming body includes a main flow path and a plurality of sub flow paths. The main flow path is formed to allow a processing liquid supplied from the outside to pass therethrough. The plurality of sub flow paths branch off from the main flow path, extend outward in a width direction perpendicular to the vertical direction of the brush main body, and are connected to an upper surface of the brush main body.

Substrate cleaning brush and substrate cleaning apparatus

A substrate treatment apparatus includes a brush moving mechanism which moves a shaft to which a cleaning brush is attached. The brush body includes a substrate contact portion of a pillar-shaped portion. The substrate treatment apparatus further includes a correcting member and a relatively-positioning mechanism. When the correcting member is placed in a target position, a contact portion of the correcting member overlaps an object portion which is a combination of a design contact portion and a belt-shaped annular portion in an outer surface of a design pillar-shaped portion of a design body of a design brush. The contact portion is formed to have an inverted shape of the object portion of the design brush, and a portion of the contact portion, which corresponds to the belt-shaped annular portion, is a center-axis facing surface which faces a center axis of the shaft.

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Kyoto, Japan

Wataru Yano