Murata Manufacturing Co., Ltd.

Wataru Yanase

Kuniaki Yosui

Satoshi Ishino

Shigeru Tago

Hidekiyo Takaoka

Yuki Wakabayashi

Kosuke Nakano

Yuki Ito

Hirofumi Shinagawa

Toshiro Adachi

Masaki Kawata

Yukio Higuchi

Yoshihiro Kawaguchi

A first structural material is bonded to a second structural material with a joining material provided with a mixed layer of a raw-material component for forming an intermetallic compound layer and a resin component that softens and flows during heat treatment interposed therebetween to form bonded structural materials. When the bonded structural materials are heat-treated, the first structural material is joined to the second structural material with an intermetallic compound layer, and the resin component exudes and covers the lateral circumferential (exposed) portion of the intermetallic compound layer with a resin film.

Method for joining structural material, joining sheet, and joint structure

A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.

Component-embedded substrate

An interface F between upper mandrels and lower mandrels are moved to a predetermined position in a cavity with the upper mandrels and the lower mandrels slidingly moving toward the lower punch while the upper mandrels and the lower mandrels remain in contact with each other, in a manner such that pressure is not applied to powdered dielectric material disposed in the cavity. The powdered dielectric material in the cavity is compressed by an upper punch and the lower punch while the upper mandrels and the lower mandrels remain in contact with each other, thereby forming a dielectric block.

Method for press-molding dielectric block

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Nagaokakyo, Japan

Wataru Yanase