Mitsui Toatsu Chemicals, Incorporated

Mitsui Chemicals, Inc.

Wataru Yamashita

Shoji Tamai

Akihiro Yamaguchi

Yoshihiro Sakata

Yuichi Okawa

Keizaburo Yamaguchi

Hideaki Oikawa

Mitsunori Matsuo

Keisuke Takuma

Tomomi Yoshimura

Masahiro Ohta

Tadashi Asanuma

Tsutomu Ishida

Atsushi Shibuya

Kenichi Fukukawa

Masaki Okazaki

Yuko Ishihara

Katsuji Watanabe

Tsutami Misawa

Tatsuhiro Urakami

Ichiro Fujio

Kazuhiro Seino

Toshiyuki Kataoka

Teruyuki Nagata

Masanobu Ajioka

Atsuo Otsuji

Masatoshi Takagi

Takahisa Oguchi

Takashi Kuroki

Kenichi Goto

Akio Karasawa

Hideki Mizuta

Katsuaki Iiyama

Rihoko Suzuki

Toshihiro Motoshima

Kan Ikeda

Yukiko Mori

Hisato Ito

Kotaro Shimizu

Osamu Kohgo

Hitoshi Ohnishi

The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%). 

Polyamic acid and polyimide, processes for the production of same, compositions containing same, and uses thereof

A polyamic acid solution includes a polyamic acid, a solvent (C) in which the polyamic acid (PAA1) is dissolved, and a substance (M) that can release at least one metal selected from groups 1 and 2 of the periodic table as a metal ion, or a substance (m) that contains the substance (M). A polyimide composite is produced from the polyamic acid solution. The polyimide composite can provide a greatly improved glass transition temperature without impairing the intrinsic physical properties of the polyimide.

Polyimide composite material and film thereof

Provided is a low-cost polyimide, containing cyclohexane diamine as a diamine unit, that has a low thermal expansion coefficient. Said block polyimide contains blocks having the repeating structural unit shown in formula (1A) and blocks having the repeating structural unit shown in formula (1B). This block polyimide is preferably obtained by imidizing a block polyamide acid imide that contains blocks having the repeating structural unit shown in formula (2A) and blocks having the repeating structural unit shown in formula (2B). 

Low-thermal-expansion block polyimide, precursor thereof, and use thereof

A positive photosensitive resin composition containing 100 parts by weight of a polyimide precursor (A) having a constituent unit represented by the formula (1), 15 to 25 parts by weight of a crosslinking agent (B) represented by the formula (2), and 2 to 5 parts by weight of a photosensitizer (C) generating acid upon irradiation of an actinic ray: 

Positive photosensitive resin composition and method for forming pattern

Polyimide and circuit substrate comprising the same

Polyamic acid, polyimide, process for producing these, and film of the polyimide

There is disclosed an organic optical component prepared from a resin essentially comprising one or more repetitive structural units selected from the group consisting of structures represented by general formula (1); ##STR1## wherein A is either of the groups below. ##STR2## This invention provides an organic optical component with excellent transparency, heat resistance and mechanical strength as well as a low birefringence. This invention also provides a novel aromatic polyamide with a low permitivity and excellent transparency, processability and thermal stability, besides excellent heat resistance inherent in an aromatic polyamide.

Fluorine-containing polyamide

A low-birefringent organic optical component comprising a polymer prepared by polymerizing a racemic mixture of the monomer with an asymmetric spiro ring represented by general formula (1) as an essential ingredient; wherein ring A represents a monocyclic or polycyclic organic group, wherein two ring As are mutually bound each other via a spiro bond to form a spiro ring which has a molecular asymmetric structure; n is an integer of 0 to 10; X.sub.1 and Y.sub.1 are binding groups; and Z.sub.1 is a polymerization-active group. The component has excellent transparency, mechanical strength and heat resistance, as well as a low birefringence.

Low-birefringent organic optical component and a spirobiindan polymer

A low birefringent organic optical component prepared from a resin consisting essentially of one or more repetitive structural units selected from the group consisting of structures represented by general formula (1); ##STR1## wherein A is either of the groups below. ##STR2## The organic optical component can exhibit excellent transparency, heat resistance and mechanical strength as well as a low birefringence. Also provided is a novel aromatic polyamide with a low permitivity and excellent transparency, processability and thermal stability, besides excellent heat resistance inherent in an aromatic polyamide.

Organic optical component

A printing ink for an optical filter, comprising a polyimide resin containing at least one perfluoroalkyl group in each recurring structural unit, at least one dyestuff soluble in the resin, the dyestuff having absorption in the visible range and/or the near infrared range and a solvent.

Polyimide resin compositions for optical filters

A preparation process of isoimide comprising reacting a compound having one or more carboxyl group and one or more amide bond in the same molecule in the presence of a haloiminium salt and basic substance, and a preparation process of isoimide comprising reacting a compound having one or more carboxyl group with a compound having one or more amide bond in the presence of a haloiminium salt and basic substance are disclosed.

Process for preparing isoimides

A polyimide resin composition for an optical filter which includes a colorless transparent polyimide resin containing at least one perfluoroalkyl group in each recurring structural unit and having excellent solvent solubility, and at least one dyestuff soluble in said resin. The dyestuff has absorption in the visible range and/or the near infrared range. A printing ink for an optical filter is composed of the polyimide resin composition and a solvent while an optical filter formed from a transparent base material and the polyimide resin composition can also be provided.

A is a polyimide based resin molding composition comprising 100 parts by weight of crystalline polyimide having recurring structural units of the formula (1): ##STR1## and 1.about.50 parts by weight of crystallization accelerators selected from bisimide compounds of specific structure, a mixture of bisimide compounds, and imide based oligomer. The composition remarkably accelerates the crystallization velocity of polyimide of the formula (1), crystallization can be completed within a greatly reduced cooling time after melt processing, and the crystallized polyimide resin has excellent properties.

Polyimide based resin composition

The invention provides a novel preparation process of a polycondensation type polymer, an excellent polymer which is represented by lactic acid and the preparation process of the polymer, a polycondensation agent used for the preparation process, and an intermediate. Specifically, the invention provides a preparation process of the polycondensation type polymer, for example, polyamide, polyimide, polythioester and polyester, comprising bonding a carboxyl group comprising compound with an active hydrogen group comprising compound in the presence of haloiminium salt. The invention provides excellent polylactic acid having a controlled D/L-isomer ratio in the repeating structural units and preparation process of polylactic acid, and further provides a haloiminium salt compound used for the preparation process and an intermediate compound of acid chloride.

Process for preparing polycondensation polymer compound

This invention relates to a novel polyimide or polyimide copolymer having excellent heat resistance and greatly improved processability, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein L is an oxygen atom, carbonyl, isopropylidene or hexafluoroisopropylidene, and X is ##STR2## and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member. The polyimide or polyimide copolymer is outstanding in melt-flow stability, and has greatly improved processability and excellent heat resistance. Consequently, the polyimide or polyimide copolymer can be applied to structural materials, and electic.cndot.electronic appliances.

Polyimide

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Kanagawa, Japan

Wataru Yamashita