Micron Technology Incorporated

Wataru Tsukada

Scott Richard Cyr

Yoshihisa Fukushima

Masayuki Honda

Takenori Sato

A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.

Semiconductor memory device including output buffer

Disclosed here is an apparatus that comprises a data terminal, a data output circuit including a plurality of output buffers coupled in common to the data terminal, and an impedance control circuit coupled to the data output circuit, wherein the impedance control circuit is configured to generate first impedance code and second impedance code different from the first impedance code and to apply a selected one of the first impedance code and the second impedance code to at least one of the output buffers.

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Sagamihara, Japan

Wataru Tsukada