Shin-Etsu Chemical Co., Ltd.

Wataru Toya

Keita Kitazawa

Masataka Deguchi

Koji Nakanishi

Mitsuhiro Iwata

Takahiro Yamaguchi

Ryo Miyazaki

Ayako Yamaguchi

A thermal-conductive silicone composition containing (A) 0.5 to 2.5 mass % of a crosslinked silicone gel containing (a) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, and having a kinematic viscosity at 25° C. of 10,000,000 mm/s or more, and (b) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule; (B) 12.5 to 19.5 mass % of a hydrolysable organopolysiloxane compound; and (C) 80 to 85 mass % of aluminum nitride particles having an average particle size of 0.5 pm or more and 1.5 pm or less. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the whole. The coarse particles are 10 pm or more in a particle size distribution by laser diffraction. A thermal-conductive silicone composition has excellent coating workability and favorable pumping-out resistance, and is capable of attaining low thermal resistance by being thinly compressed.

Thermal-conductive silicone composition

A thermal-conductive silicone composition containing: (A) a hydrolysable organopolysiloxane having an alkoxysilyl group; and (B) aluminum nitride particles having an average particle size of 0.5 μm or more and 2.0 μm or less and contained in an amount of 50 to 70 volume %. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the entire aluminum nitride particles, the coarse particles having particle sizes of 10 μm or more according to a particle size distribution measurement method by laser diffraction. The thermal-conductive silicone composition has a heat conductivity of 1.3 W/mK or more according to a hot disc method. The present invention provides: a thermal-conductive silicone composition having high heat conductivity and being compressible to 10 μm or less; and a production method of the thermal-conductive silicone composition.

Thermal-conductive silicone composition, production method therefor, and semiconductor device

A non-curable thermal-conductive silicone composition contains essential components of: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 1,000,000 mm/s or more in an amount of 5 to 20 mass % relative to a sum of the component (A) and a component (B); (B) a hydrolysable organopolysiloxane compound shown by the following general formula (1) in an amount of 80 to 95 mass % relative to the sum of the components (A) and (B); and (C) a heat conductive filler in an amount of 10 to 95 mass % relative to a total amount of the composition. A mixture of the components (A) and (B) has a molecular weight distribution Mw/Mn of 10 or more. Rrepresents a monovalent hydrocarbon group having 1 to 10 carbon atoms optionally having a substituent. 'm' represents an integer of 5 to 100.

Non-curable thermal-conductive silicone composition

This silicone composition contains (Ris an alkyl group having 1-6 carbon atoms, Ris Ror a hydrogen atom, n is an integer between 2 and 40, m is an integer between 0 and 98, and the value of n+m is such that 5&#x2264;n+m&#x2264;100),

Silicone composition

Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm/s at 25&#xb0; C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40&#xb0; C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m&#xb7;&#xb0; C.) per 100 total parts by mass of components (A) and (B).

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Annaka, Japan

Wataru Toya