Seiko Epson Corporation

Wataru Takahashi

Masahiro Kanai

Yasuhide Matsuo

Kenji Otsuka

Takayoshi Mizuno

Mitsuyoshi Soyama

Masaru Kamisawa

Hitoshi Matsumoto

Hiroshige Owaki

Yoshinao Miyata

Hiroaki Okui

Hiroyuki Kobayashi

Kazushige Umetsu

Satoshi Kimura

Yutaka Yamazaki

Kei Tadachi

Satoshi Suzuki

Hiroyuki Tsuchiya

A liquid ejecting head includes a flow path substrate configuring a side face of a pressure chamber in communication with a nozzle through which a liquid is ejected, a diaphragm including a first face joined to the flow path substrate and a second face on an opposite side of the diaphragm to the first face, and a drive device provided on the second face and configured to change pressure in the pressure chamber. A corner of the side face of the pressure chamber includes a curved face having a center of curvature positioned in the pressure chamber in plan view, a recess is formed in the first face, and the pressure chamber is positioned inside the recess in plan view.

Liquid ejecting head and liquid ejecting apparatus

A liquid ejecting head (recording head) includes a structure (flow path member) having a plurality of stacked plates (a nozzle plate, a flow path plate, and a diaphragm) in which end surfaces at both sides in one direction are aligned. At least two plates of the plates (the nozzle plate, the flow path plate, and the diaphragm) have different coefficients of linear expansion in the one direction, and holding members are fixed to the end surfaces of the structure (flow path member) at both sides in the one direction, the holding members having stiffness higher than stiffness of a plate having the highest coefficient of linear expansion in the one direction among the plates (the nozzle plate, the flow path plate, and the diaphragm).

An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.

Electronic device, liquid ejection head, and method of manufacturing electronic device

A method for manufacturing a MEMS device in which a plurality of substrates are joined in a stacked state and one face of faces defining a space formed in one substrate of the plurality of substrates is a movable region is disclosed.

Method for manufacturing MEMS device, MEMS device, liquid ejecting head, and liquid ejecting apparatus

A wiper device allows a liquid ejecting head that ejects a dispersion liquid in which solid particles are dispersed in a liquid from nozzles and a wiping member to move relative to each other so as to wipe the dispersion liquid that adheres to a nozzle formation surface using the wiping member. The wiping member includes a first layer positioned on the nozzle formation surface side, and a second layer positioned on the opposite side to the nozzle formation surface with respect to the first layer. The first layer guides liquid droplets which are dispersion media of the dispersion liquid that adheres to the nozzle formation surface to the second layer through a capillary action and has voids that are able to capture and accommodate a dispersoid of the dispersion liquid. The second layer absorbs the dispersion media.

Wiper device and liquid ejecting apparatus

A method for dividing a wafer into a plurality of chips is provided. The method includes providing recesses in a surface of the wafer at positions along boundaries between regions to become the individual chips, providing fragile portions having a predetermined width inside the wafer at positions along the boundaries by irradiation of the other surface of the wafer with a laser beam whose condensing point is placed inside the wafer, the fragile portions including connected portions at least at one of the surfaces of the wafer, and dividing the wafer at the fragile portions into the individual chips by applying an external force to the wafer.

Method for dividing wafer, method for manufacturing silicon devices, and method for manufacturing liquid ejecting heads

An apparatus for transferring and spreading a high-viscosity bonding agent to a thickness of about 10 .mu.m on a bonding-agent onto a member. The device includes a squeegee table on which a bonding agent is spread, and a film moving device for feeding a film made of elastic material from one end to the other end of the squeegee table at a predetermined speed and sticking the film onto the bonding agent. The film moving device then peels the film off the spreading side at a speed at which the upper half of the bonding agent layer is peeled off from the other end of the squeegee table, whereby the thickness of the bonding agent is reduced to half of that which has been spread on the squeegee table. The film moving device then feeds the film having the bonding agent onto a member and peels off the film from the member, thereby transferring a bonding agent having a thickness of about 1/4 of the thickness of the bonding agent spread on the spreading side, not greater than 10 .mu.m, for example, to the member.

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Chino, Japan

Wataru Takahashi