Hitachi Automotive Systems, Ltd.

Hitachi-kokusai Electric Inc.

Fujifilm Healthcare Corporation

Wataru Sawada

Satoshi Arai

Toru Watanabe

Shigeharu Tsunoda

Masaru Kamoshida

Toshikazu Shigyo

Takahiro Miura

An ultrasonic probe has a transduction layer in which a plurality of transducers are placed, a backing layer provided at a rear side of the transduction layer with a wiring layer therebetween, and a plurality of heat dissipation members provided in the backing layer. The plurality of heat dissipation members extend in a line form in the backing layer, and are placed with an aligned direction of extension. An area occupancy percentage of the heat dissipation member at a center region of the backing layer is larger than that at an outer side of the center region. The center region is not positioned at ends of the cross section intersecting the direction of extension of the heat dissipation member, includes a center of gravity of the cross section, and occupies an area less than or equal to a half of an area of the cross section.

Ultrasonic probe with heat dissipation members arranged in center of backing layer

A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.

Laser welded structure, electronic controller and manufacture method for laser welded structure

A high frequency circuit device that can avoid an occurrence of a stress concentration to a dielectric substrate during a temperature increase caused by a difference in coefficients of linear expansions of a chassis and a metal housing of a high frequency module is provided.

High frequency circuit device

Growing community of inventors

Tokyo, Japan

Wataru Sawada