Screen Holdings Co., Ltd.

The Yokohama Rubber Co., Ltd.

Kyoto Institute of Technology

Wataru Sakai

Hiroaki Ishii

Yosuke Yasutake

Yutaka Ikegami

Kenji Kobayashi

Hiroshi Abe

Manabu Okutani

Fumito Yatsuyanagi

Takashi Ota

Noriyuki Kikumoto

Ryo Muramoto

Toyohide Hayashi

Yuko Sekine

Sei Negoro

Michinori Iwao

Ryosuke Sakai

Yu Shinke

Takaaki Ishizu

Naoto Fujita

Takuma Arikawa

The substrate processing apparatus includes a suction holding mechanism, a rotation mechanism, a plurality of lift pins, a vertical movement mechanism, and a horizontal movement mechanism. The suction holding mechanism sucks and holds a substrate. The rotation mechanism rotates the suction holding mechanism holding the substrate about the rotation axis. The vertical movement mechanism moves the plurality of lift pins in the vertical direction. A sensor measures the eccentric state of the substrate W held by the suction holding mechanism. The vertical movement mechanism supports the substrate from the suction holding mechanism by moving the plurality of lift pins and the horizontal movement mechanism moves the plurality of lift pins based on the eccentric state of the substrate measured by the sensor in a state where the substrate is supported.

Substrate processing apparatus

A substrate processing method includes a liquid film forming step of forming a liquid film, a liquid film heat retaining step of keeping the liquid film warm, a gas phase layer forming step of forming a gas phase layer which holds the processing liquid on a center portion of the liquid film, an opening forming step of forming an opening in the center portion of the liquid film by excluding the processing liquid held by the gas phase layer, a substrate rotating step of rotating the substrate around a rotation axis, and an opening expanding step of expanding the opening, while a state in which the gas phase layer is formed on an inner circumferential edge of the liquid film is maintained, by moving the irradiation region toward a circumferential edge portion of the substrate while the liquid film heat retaining step and the substrate rotating step are performed.

Substrate processing method and substrate processing apparatus

A holding mechanism holds a substrate horizontally. A rotation mechanism rotates the holding mechanism holding the substrate. A nozzle supplies a processing liquid to the substrate. A nozzle arm holds the nozzle. An arm actuation mechanism moves the nozzle arm between a processing position overlapping the substrate in plan view and a retracted position displaced from the substrate in plan view. A cup portion is disposed around the holding mechanism, and receives the processing liquid from the substrate. A cup actuation mechanism moves the cup portion up and down between an upper position and a lower position. A first container is fixed to the cup portion to be movable up and down integrally with the cup portion, and can accommodate the nozzle at the retracted position.

A rubber composition of the present technology is a rubber composition including a diene rubber and a filler; the diene rubber containing at least a styrene-butadiene copolymer; a radical generation index of the styrene-butadiene copolymer being not greater than 1.0 and being smaller than a value Y calculated by Equation (1): Y=&#x2212;0.0186&#xd7;(SV mass %+vinyl unit mol %)+1.5.

Rubber composition and pneumatic tire

A substrate processing apparatus includes a spin chuck, rotating a disk-shaped substrate around a rotational axis while holding it horizontally, a cylindrical guard, receiving a processing liquid scattered outward from the substrate held by the spin chuck, and a centering unit, which brings a center of the substrate close to the rotational axis. The centering unit includes a pusher, contacting the substrate on the spin chuck, and a linear motor, moving the pusher horizontally to move the substrate horizontally with respect to the spin chuck. At least a portion of the linear motor is disposed above the guard such as to overlap with the guard in plan view.

Substrate processing apparatus and substrate processing method

Growing community of inventors

Kyoto, Japan

Wataru Sakai