Denso Corporation

Subaru Corporation

Tosoh Corporation

Other

Japan Aerospace Exploration Agency

Kyushu University

Openheart Ltd.

A Limited Responsibility Company, Research Network

Wataru Kobayashi

Hirotaka Hayashi

Kazuki Koda

Masao Nakano

Mizuki Nakamura

Masafumi Sasaki

Takumi Nomura

Eiji Hayashi

Yasutada Tanabe

Noboru Kobiki

Kazuki Kouda

Takahiro Hirano

Shigeto Okada

Tomomi Okumura

Hiroshi Taguchi

Hiroyuki Fujisaki

Sei Iguchi

Nobukazu Oba

Yasuhiro Yamashita

Kengo Oka

Daisuke Fukuoka

Eiji Nomura

Toshiya Takahara

Masaki Okada

Yuji Matsumoto

Hokuto Yamane

Yukinori Yamashita

Hideaki Sugawara

Keita Yonai

Kazuhiko Furuya

Baowei Xie

Yuuji Ootani

Tomoaki Mitsunaga

Takamichi Sakai

Masato Ito

Ryo Sakamoto

Provided is a flight efficiency improving system for a compound helicopter with a rotor and fixed wings. In forward flight of the compound helicopter, the flight efficiency improving system does not perform a cyclic pitch control of the rotor so as to allow a difference in lift generated by the rotor between an advancing side and a retreating side of the rotor, or the flight efficiency improving system performs the cyclic pitch control to an extent that does not completely eliminate the difference. The fixed wings are provided respectively on left and right sides of a body and are asymmetric to each other so that influence of an aerodynamic interference between the rotor and the fixed wings is reduced.

Flight efficiency improving system for compound helicopter

To provide an aqueous sodium ion secondary battery which can achieve a high electrochemical capacity as compared with a known sodium ion secondary battery having an aqueous electrolytic solution. An aqueous sodium ion secondary battery includes a cathode, an anode, an electrolytic solution and a separator, wherein the cathode has at least a cathode active material containing at least a sodium transition metal polyanion represented by the formula NaMPOCO(M is at least one member selected from the group consisting of Fe, Mn, Ni and Co, and x is 0 or more and 2 or less), and the electrolytic solution is an aqueous electrolytic solution.

Aqueous sodium ion secondary battery

In a semiconductor device, a semiconductor element has a front electrode and a back electrode. The back electrode is connected to a wiring member through a bonding member. Wire pieces are disposed in the bonding member, and bonded to a bonding surface of the wiring member to protrude toward the semiconductor element. The bonding member has, in a plan view, a central region that overlaps with a central portion of the semiconductor element including an element center, and an outer peripheral region that includes a portion overlapping with an outer peripheral portion of the semiconductor element surrounding the central portion and surrounds the central region. At least four wire pieces are disposed in the outer peripheral region at positions corresponding to at least four respective corners of the semiconductor element. At least one wire piece is disposed to extend toward the element center in the plan view.

Semiconductor device having wire pieces in bonding member

An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

Electronic device and method for manufacturing same

A compound helicopter includes a fuselage, a fixed wing, a rotary wing, and a barrier member. The fixed wing is fixed to the fuselage. The rotary wing is rotatably coupled to the fuselage. The barrier member is attached to a part, of the fuselage, that is above the fixed wing and is between the rotary wing and the fixed wing. The barrier member is configured to generate no lift upon forward flight.

Compound helicopter

A lift-changing mechanism is configured to change generated by a wing of an aircraft and includes a slit and an opening and closing member. The slit extends in a wingspan direction inside the wing and forms openings on the lower surface of the wing and on the upper surface of the wing respectively. A part of airflow below the lower surface is allowed to flow toward the upper surface through the slit. The opening and closing member is configured to open and close the slit. When the opening and closing member opens the slit, lift generated on the wing is decreased compared with when the slit is closed.

Lift-changing mechanism

Provided is a vibration control system for a compound helicopter with a rotor and a fixed wing. The fixed wing includes a movable flap that is mounted on a rear edge of the fixed wing. The vibration control system periodically moves the movable flap so as to periodically change lift of the fixed wing such that vibration aerodynamically generated by the fixed wing is in anti-phase with vibration caused by rotation of the rotor.

Vibration control system for compound helicopter

An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.

Electronic device and method for manufacturing the same

A rotor blade for an aircraft includes first and second blade tips, a blade body, and a vortex-generating blade. The blade body has an end forming the first blade tip of the rotor blade and an airfoil section configured such that during rotation, pressure acting on a lower surface of the blade body is greater than pressure acting on an upper surface of the blade body. The vortex-generating blade is disposed at an end of the rotor blade and forms the second blade tip. The vortex-generating blade also has an airfoil section configured such that during rotation, pressure acting on a lower surface of the vortex-generating blade is smaller than pressure acting on an upper surface of the vortex-generating blade.

Rotor blade for aircraft

A base material includes one surface, and a side surface continuous with the one surface. Each of the one surface and the side surface has a sealed region to be sealed with mold resin. The one surface has a one surface rough region in the sealed region thereof. The side surface has a side surface rough region in the sealed region thereof.

Base material, mold package, base material manufacturing method, and mold package manufacturing method

A metal member includes a metal substrate and a porous metal layer. A composite includes the metal member and a resin member. The metal substrate has one surface, is made of a metal material, and has a region formed as an uneven layer having an uneven shape with respect to the one surface. The porous metal layer has a mesh-like shape and is formed on the uneven layer. The uneven layer includes a plurality of protrusions protruding in a direction normal to the one surface.

Metal member, composite of metal member and resin member, and production method therefor

A semiconductor device includes: a semiconductor chip having an electrode on one surface; a first conductive member disposed on one surface side of the semiconductor chip; a metal member having a base member and a membrane and disposed between the semiconductor chip and the first conductive member; a first solder disposed between the electrode of the semiconductor chip and the metal member; and a second solder disposed between the metal member and the first conductive member. The membrane has a metal thin film arranged on the surface of the base member and an uneven oxide film. The uneven oxide film is arranged on the metal thin film in at least a part of a connection region of a surface of the metal member, the connection region connecting a first connection region to which the first solder is connected and a second connection region to which the second solder is connected.

Semiconductor device and method for manufacturing same

A semiconductor device includes: a semiconductor element; a case; a terminal made of a conductive material and embedded in the case, a part of the terminal being exposed to the outside, having an outermost surface that includes a first film, and having a base portion; a bonding wire that is connected to the first film and electrically connects the semiconductor element and the terminal; and a protection member that is more flexible than the case and covers a contact portion of the terminal contacting with the bonding wire. The first film is removed from an area around the contact portion with the bonding wire in the part of the terminal being exposed to the outside, causing the base portion to be exposed. An exposed portion of the base portion and the protection member adhere to each other.

Semiconductor device

Growing community of inventors

Kariya, Japan

Wataru Kobayashi