Kelk Ltd.

Tohoku University

Komatsu Electronics Inc.

Wataru Kiyosawa

Atsushi Kobayashi

Norio Takahashi

Hideaki Ohkubo

Masato Horikoshi

Shigenao Maruyama

Atsuki Komiya

Hiroaki Takechi

Shunsuke Kushibiki

A temperature control device includes: a top plate that supports a substrate; a base plate connected to the top plate so as to form an internal space with the top plate; a thermoelectric module plate arranged in the internal space; a heat exchange plate that is arranged in the internal space and exchanges heat with the thermoelectric module plate; and a sealing member that comes into contact with each of the top plate and the base plate.

Temperature control device

A temperature control device includes: a top plate that supports a substrate; a base plate connected to the top plate so as to form an internal space with the top plate; a thermoelectric module plate arranged in the internal space; a heat exchange plate that is arranged in the internal space and exchanges heat with the thermoelectric module plate; a first coupling member that couples the top plate and the base plate via the thermoelectric module plate and the heat exchange plate and is fixed to each of the top plate and the base plate; and a second coupling member that couples the top plate and the base plate via the thermoelectric module plate and the heat exchange plate, is fixed to the top plate, and is movable relative to the base plate.

A temperature adjustment apparatus suppresses decline in temperature adjustment performance by avoiding even partial impairment of the function of a thermoelectric module in respective zones, which is accomplished due to the presence of terminals. A terminal is provided via an electrode extension section on a heat exchange plate side electrode of the thermoelectric module of inner zones apart from an outermost zone, of four zones. The electrode extension section is disposed at a position which is sandwiched between adjacent thermoelectric elements and over which a temperature adjustment side electrode spans. The terminals are disposed outside the thermoelectric module in the outermost zone.

Temperature adjustment apparatus

A thermoelectric module includes a thermoelectric element and an electrode. The thermoelectric element has a rectangular end face. The electrode includes a first joint portion joined to a center portion of the end face; and a second joint portion joined to one end and a third joint portion joined to the other end. Each of the second joint portion and the third joint portion is disposed at a distance from each of four corners of the end face. A joint length in the second direction orthogonal to the first direction between the first joint portion and the end face is longer than each of a joint length in the second direction between the second joint portion and the end face, and a joint length in the second direction between the third joint portion and the end face.

Thermoelectric module

When a temperature of a semiconductor wafer is controlled to be a target temperature by raising the temperature of the semiconductor wafer, switching is performed so that a high-temperature circulating liquid at a temperature higher than the target temperature in a high-temperature tank is supplied into an inside-stage flow channel, and respective thermoelectric elements in a plurality of zones in a stage are controlled; and then, the temperature of the semiconductor wafer matches the target temperature and a desired in-plane temperature distribution of the semiconductor wafer is provided.

Apparatus and method for controlling temperature of semiconductor wafers

Resins () are interposed as insulating layers between heat radiation side and heat absorption side heat exchange bodies () and heat radiation side and heat absorption side electrodes () of a thermoelectric conversion element module (). The resin () is fusion bonded to the heat radiation side heat exchange body (), and the resin () is fusion bonded to the heat radiation side heat exchange body (). The material of the resins () is, for example, a thermosetting plastic. The thermosetting plastic becomes soft when heated and then cures. At the time of fusion bonding of the resins () to the heat exchange bodies (), the heat exchange bodies () and the resins () are heated and pressed. Then, the resins () become soft and enter the cavities and flaws formed in the surfaces of the heat exchange bodies (). The resins () having entered the cavities and flaws cure to fill the cavities in the surfaces of the heat exchange bodies ().

Growing community of inventors

Hiratsuka, Japan

Wataru Kiyosawa