Tokyo Electron Limited

Tokyo Electron Kabushiki Kaisha

Tokyo Electron Yamanashi Limited

Wataru Karasawa

Shigeoki Mori

Masaru Suzuki

Tadashi Obikane

Itaru Takao

Keiichi Yokota

Hisashi Koike

Yoshihito Marumo

Taketoshi Itoyama

Ryuichi Takebuchi

Hitoshi Fujihara

Masaaki Iwamatsu

There is provided a system and method for monitoring an apparatus from a remote location. A vendor-side computer obtains operating state data obtained by a monitoring device provided in an apparatus via a communication line, and monitors the operating state of the apparatus from a remote location. Maintenance data at a part replacing time is transmitted from the apparatus, and the vendor-side computer that has received maintenance data calculates an optimal replacement period of a part based on this. The calculated optimal replacement period of each part is sent to a plant. The plant feeds the optimal replacement period back to the operating of the apparatus.

Apparatus productivity improving system and its method

There is provided a system and method for monitoring an apparatus from a remote location. A vendor-side computer obtains operating state data obtained by a monitoring device provided in an apparatus via a communication line, and monitors the operating state of the apparatus from a remote location. Maintenance data at a part replacing time is transmitted from the apparatus, and the vendor-side computer that has received maintenance data calculates an optimal replacement period of a part based on this. The calculated optimal replacement period of each part is sent to a plant. The plant feeds the optimal replacement period back to the operation of the apparatus, so that productivity can be improved.

A device inspection apparatus inspects a plurality of semiconductor devices on an individual device basis. An inspection target sorting part () omits an execution of an inspection to be applied to the semiconductor devices according to information which specifies a defective device that has been determined to be defective in a manufacturing process that has been applied to the device.

Semiconductor device inspection system

In a semiconductor manufacturing system, operations of a plurality of processing apparatuses are controlled so as to efficiently manufacture semiconductor devices. The semiconductor manufacturing system having at least one processing apparatus for applying a process to semiconductor substrates. A memory part () stores priority-level data which indicates a priority level of the process to be applied to each of the semiconductor substrates on an individual semiconductor substrate basis. A control part () controls the processing apparatus to apply the process to a newly supplied one of the semiconductor substrates by determining an order of processing the newly supplied one of the semiconductor substrates being supplied to the processing apparatus based on a comparison of new priority-level data with the priority-level data stored in the memory part with respect to the semiconductor substrates of which process has been scheduled, the new priority-level data being supplied in response to the newly supplied one of the semiconductor substrates being supplied to the processing apparatus.

Semiconductor manufacturing system and control method thereof

A probing test method including contacting probe of a probe card with pad on an IC chip on a semiconductor wafer, relatively moving each of the probe along the top of each of the pad, and sending test signal to the pad through the probe. Oxide film on the top of each of the pads can be removed by relative motion between each probe and each pad at an area where they are contacted with each other, contact resistance between the probes and the pads can be reduced to a greater extent, and test signal can be more reliable transmitted between the probes and the pads.

Probing test method of contacting a plurality of probes of a probe card

A probe apparatus which has a probe card having a plurality of probes, a wafer holder located above or beside the probe card, for holding a wafer to be examined, a tester head electrically connected to the probes of the probe card, a tester electrically connected to the tester head, for detecting electrical characteristics of the wafer from the data output from the wafer, and a CCD camera arranged to oppose the object, for detecting the position of the wafer.

Probe apparatus with a swinging holder for an object of examination

A method for positioning and testing an object to be tested wherein the surface of an object to be tested for electrical characteristics is brought into contact with a test probe. The side of the object opposite the surface to be tested is held by a suction device on the end of one of many arms which are attached to a rotating shaft. The object is then transported to a position to bring it into contact with the test probe where testing is performed to determine whether or not the object is faulty. If necessary, the arms are manipulated in an up and down and an in and out direction with respect to the shaft, and the suction device rotated, to maintain the object to be tested in a proper orientation.

Electrical characteristics measurement method and measurement apparatus

A probe apparatus having a probe card having plurality of probes, a member arranged above the probe card to hold an object to be probed, and a test head electrically connected to the probes of the probe card.

Probe apparatus for probing an object held above the probe card

In a method of inspecting the electric characteristics of wafers, detecting for second and subsequent alignment operations of probe cards is automatically executed. In an apparatus for inspecting the electric characteristics of wafer, different types of wafers can be continuously inspected using the same probe card on the basis of prestored alignment data of each type of wafers.

Method of inspecting electric characteristics of wafers and apparatus

A probe apparatus having a measuring section with a first system for electrically measuring an object. A loader section has a second system for carrying objects to the measuring section and a marking section has a third system for marking objects. These sections are independent of each other so that a vibration occurring in one section is not transmitted to the other sections.

Probe apparatus

Wafer probe plate holder

This invention relates to a method and apparatus for performing a probing test for sequentially testing chips formed on a semiconductor wafer in a matrix form. An area of a chip subjected to the test or a chip excluded from the test on the wafer is preset, the preset-area information is stored, and only chips subjected to to the test are tested on the basis of the sequentially readout preset-area information.

Method and apparatus of performing probing test for electrically and

An apparatus and method of testing semiconductor wafer, which are capable of properly processing inking errors caused in the process of determining whether the chips are good or bad. The apparatus comprises an inker for markings those chips which have been found defective by probing test, a TV camera for imaging the chips including those which have been found defective and marked, a computer system for comparing an image-signal with a reference-signal, and determining that the chip has no marking when the signals coincide and that the chip has a marking when the signals do not coincide, and a counter for counting those chips which have been determined to have markings or no marking by the computer system.

Apparatus and method of testing a semiconductor wafer

A probe apparatus is disclosed, in which, when performing a predetermined processing on an object having a pattern recurring at a predetermined pitch by moving the object at a pitch equal to the predetermined pitch, the difference between the pitch of actual movement of the object and the pitch of the recurrence of pattern is detected by pattern recognition, and the pitch of movement of the object is corrected according to the detected difference.

Growing community of inventors

Yokohama, Japan

Wataru Karasawa