Shinko Electric Industries Co., Ltd.

Wataru Kaneda

Noriyoshi Shimizu

Akio Rokugawa

Toshinori Koyama

Masato Tanaka

Hitoshi Sakaguchi

Hiromu Arisaka

Kaori Yokota

A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

Wiring board and method of manufacturing the same

A wiring board includes: a first insulating layer which is made of an insulating resin containing a thermosetting resin as a main component; a recess portion formed in an upper surface of the first insulating a layer; a first wiring layer formed in the recess portion and comprising an upper surface exposed from the first insulating layer; a via wiring penetrating the first insulating layer in a thickness direction thereof and comprising an upper end surface exposed from the first insulating layer; a second wiring layer formed on the upper surface of the first insulating layer to contact the upper end surface of the via wiring and the upper surface of the first wiring layer; and a second insulating layer which is made of an insulating resin containing a photosensitive resin as a main component and which is formed on the upper surface of the first insulating layer.

Wiring board, semiconductor package, and semiconductor device

A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole.

Wiring board, semiconductor device, and method of manufacturing wiring board

A wiring substrate includes, a base wiring substrate including a first wiring layer, a first insulating layer in which the first wiring layer is buried and a first via hole is formed under the first wiring layer, and a second wiring layer formed under the first insulating layer and connected to the first wiring layer through the first via hole, and a re-wiring portion including a second insulating layer formed on the base wiring substrate and having a second via hole formed on the first wiring layer, and a re-wiring layer formed on the second insulating layer and connected to the first wiring layer through the second via hole. The re-wiring layer is formed of a seed layer and a metal plating layer provided on the seed layer, and the seed layer is equal to or wider in width than the metal plating layer.

Wiring substrate and method of manufacturing the same

A method of manufacturing a wiring substrate includes: preparing a laminated plate of a metal layer and an insulating layer; adhering the laminated plate to a first support body facing the metal layer; and forming a first wiring layer with vias extending through the insulating layer and first pads exposed from a first surface of the insulating layer. The method also includes: separating a multilayer structure including the metal, insulating, and first wiring layer from the first support body; adhering the multilayer structure to a second support body facing the first wiring layer; removing the metal layer; forming a plurality of second wiring layers including second pads connected to the vias and exposed from a second surface of the insulating layer opposite the first surface; and separating the insulating, the first wiring, and the plurality of second wiring layers from the second support body, to obtain the wiring substrate.

Method of manufacturing wiring substrate

A wiring board includes first insulating layers and second insulating layers formed on a core layer in this order; a third insulating layer and a solder resist layer formed on another surface of the core layer in this order, first wiring layers and second wiring layers formed in the first insulating layers and the second insulating layers, respectively, wherein a first end surface of the first via wiring exposes from the first surface of the outermost first insulating layer to be directly connected with an outermost second wiring layer, the first via wiring and the outermost second wiring layer being separately formed, the first surface of the outermost first insulating layer and the first end surface of the first via wiring are polished surfaces, smooth surfaces and are flush with each other, and the wiring density of the second wiring layers is higher than that of the first wiring layers.

Wiring board

A wiring board includes a first insulating layer containing a thermosetting resin, a first wiring layer stacked on an upper surface of the first insulating layer, a second insulating layer stacked on the upper surface of the first insulating layer, a second wiring layer stacked on an upper surface of the second insulating layer, and a third insulating layer stacked on the upper surface of the second insulating layer. The second and third insulating layers contain a first photosensitive resin. An outer side surface of the second insulating layer is flush with an outer side surface of the first insulating layer. An outer side surface of the third insulating layer is located inside the outer side surface of the second insulating layer in a plan view. The upper surface of the second insulating layer connecting to the outer side surface thereof is exposed from the third insulating layer.

Growing community of inventors

Nagano, Japan

Wataru Kaneda