Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Wataru Hirai

Muneyoshi Fujiwara

Kunio Sakurai

Osamu Okuda

Minoru Yamamoto

Hirokazu Honkawa

Seiichi Mogi

Hiroshi Ohta

Hiroaki Onishi

Takahiro Yonezawa

Koichi Nagai

Naoyuki Kitamura

Toshinori Mimura

Hiroshi Yamauchi

Hiroyuki Fujiwara

Hironori Konno

Takashi Andoh

Akiko Ida

Shinichiro Endo

Yuuji Nagasawa

Hiroaki Imagawa

Satoshi Shida

Noriaki Yoshida

Tomoyuki Nakano

Makito Seno

Ryoji Inutsuka

Youichi Nakamura

Naoto Hosotani

Yoshiyuki Nagai

Osamu Nakao

Masanori Yasutake

Kunio Ohe

Hideo Sakon

Motoshi Shitanda

Shiro Oji

Takao Eguchi

Makoto Kawai

Koji Fujiwara

Yasuyuki Ishitani

Makoto Nakashima

Youichi Makino

Kazunobu Sakai

Naohiko Chimura

A viscous material application apparatus includes a main body having a pressurized chamber which connects through to a discharge port and stores a viscous material, a viscous material supply device for transferring the viscous material to the pressurized chamber, and a discharge pressure regulating device for regulating the discharge pressure of the viscous material when the viscous material inside the pressurized chamber is pressurized and discharged by increasing or decreasing the capacity of the pressurized chamber, the discharge pressure regulating device being provided either inside the pressurized chamber or facing the pressurized chamber.

Viscous material application apparatus

A component mounting apparatus and a component mounting method which improve accuracy and a rate of placement of components onto a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation of the component from a normal suction status is determined on the basis of component recognition information obtained from this recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding placement of the component is controlled on basis of a magnitude of the deviation. By this control, the accuracy and rate of placement of components onto the circuit-formed member can be improved.

Part mounting apparatus and part mounting method

An apparatus for supplying a component carrier in the form of a tape is provided. The component carrier has a number of cavities formed on one surface thereof for containing components. A pair of spaced first and second guide plates that function to guide one surface of the component carrier. A movable guide plate is disposed between the first and second guide plates so that it can move back and forth between a first position adjacent to the first guide plate for defining a component pickup station and a second position adjacent to the second guide plate. The movable guide plate has an extension which extends along at least one longitudinal edge of the component carrier and opposes the one surface of the component carrier for preventing movement thereof when the movable guide plate takes the first position.

Component supply system

An apparatusfor supplying a component carrier in the form of a tape is provided. The component carrierhas a number of cavitiesformed on one surface thereof for containing components. A pair of spaced first and second guide platesandguide one surface of the component carrier. A movable guide plateis disposed between the first and second guide plates so that it can move back and forth between a first position adjacent to the first guide plate for defining a component pickup stationand a second position adjacent to said second guide plate. The movable guide plate has an extensionwhich extends along at least one longitudinal edge of the component carrier and opposes to said one surface of said component carrier for preventing movement thereof when the movable guide plate takes the first position.

Part feeder

There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process time by performing picking up, delivering and receiving of components between heads, and mounting of the components onto the circuit board in parallel. A plurality of reverse-supply heads are mounted on a component supply holder for performing indexing rotation, while a plurality of mounting heads are mounted on a component mounting holder for performing indexing rotation in synchronization with the indexing rotation of the component supply holder. By (i) picking up an electronic component, (ii) delivering the electronic component from the reverse-supply head to the mounting head, and (iii) mounting the electronic component onto the circuit board at prescribed positions, operations from (i) to (iii) can be carried out in parallel. Thus, the electronic components can be mounted onto the circuit board in a short process time.

Component mounting apparatus

It is an object of the invention to suck the central position of an electronic part precisely, and enhance the successful suction rate of electronic parts. To achieve the object, the central position of the suction opening provided in the nozzle tip end for sucking an electronic part is deviated from the central position of rotation of the nozzle tip end by a specified amount, and the rotation amount of the nozzle tip end and the positioning position of the part supply portion are controlled.

Electronic part mounting machine

An electronic component mounting apparatus includes a plurality of pickup nozzles (,) which are attached to the periphery of a rotary table, that intermittently rotates. The apparatus also includes a cylindrical cam (,) having a cam groove (,) which allows the pickup nozzles (,) to move up and down. A first roller (,) is attached to a first slide portion (,), which is equipped with the pickup nozzles,. The first roller runs within the cam grooves (,) to make the pickup nozzles,move up and down. A second roller (,) is attached to a second slide portion,which is attached to the pickup nozzles (,). The second roller runs within the cam grooves (,) to make the pickup nozzles move up and down together with the first roller. Also, springs (,) are provided for biasing the first and second rollers (,) into contact with the two side surfaces, respectively, of the cam grooves (,).

Electronic part mounting device

By lightening the impact load to an electronic component and greatly promoting the load range, the adaptability to the electronic components is enhanced and the manned manual operation is eliminated, thereby improving the productivity and realizing unmanned operation. The vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle (,) for vacuum-clamping the electronic component, a positioning section (,) for positioning the vacuum-clamping nozzle (,) in a rotating direction and a vertical direction, a pushing section (,) for urging said vacuum-clamping nozzle (,) downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of said vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load. Switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board.

Electronic component mounting apparatus

Electronic component feeder

A component mounting apparatus for automatically mounting components on a circuit board includes a mounting unit for picking up a component from a component pickup location and mounting it at a mounting location. The mounting table can be driven to the pickup location and can removably secure a cassette table that can support a plurality of components that are to be mounted on the circuit board. A cassette table can be removable clamped to the mounting table. A carrier cart can transport the cassette table to a position for attachment to the mounting table. The carrier cart can be appropriately aligned and secured relative to the mounting table to enable the cassette table to be removably attached to the mounting table.

A method for supporting a printed board. Includes a first step of conveying to a specified position by a conveying a printed board having a first reference hole and a second reference hole device a for setting a position and posture thereof. A second step stops the conveyed printed board at the specified position with a stop member. A third step inserts a first reference pin provided at the specified position into the first reference hole of the stopped printed board. A fourth step inserts a second reference pin into the second reference hole of the printed board. The second reference pin is movable in parallel to a mounting surface of the printed board and in any arbitrary direction relative to the first reference pin. A fifth step pinches the printed board to hold the position and posture thereof of a holding device with the first reference pin and the second reference pin both inserted. A sixth step draws out, after the fifth step, at least one reference pin of the first reference pin and the second reference pin from its corresponding reference hole. A seventh step mounts after the sixth step, an electronic component onto the printed board under the control of a control unit.

Method and apparatus for supporting printed board

A component mounting apparatus and method for mounting components on to-be-mounted positions of works, includes a carrying device for continuously and successively carrying the works in a working area, and a first component-mounting device for picking up one component from component supply units in a first component supply section and mounting the picked-up component on the to-be-mounted position of one of the works being continuously and successively carried in the work area.

Component mounting apparatus and method

A component-mounting apparatus includes a component supply mechanism for supplying components to be mounted on a circuit board, a circuit board positioning device for placing in position the circuit board on which the components are to be mounted, and a mounting head for taking out one of the components at a predetermined component take-out position of the component supply mechanism, thus mounting the component on the circuit board. The component supply mechanism includes a plurality of supply tables on which a plurality of component supply devices have been arranged at predetermined intervals, a driving device for moving the supply tables in a direction in which the component supply devices have been arranged, thus placing the desired component supply device at the predetermined component take-out position, and a table exchange device provided at one end of a movable range of the supply tables to be driven by the driving device and allow the supply tables to be placed thereon and allow positions of the desired supply table to be switched by the driving device.

Component-mounting apparatus and method

A method for mounting components, includes a first step for feeding to a component feed unit a plurality of stacked-in-stages trays on which components are accommodated, a second step for taking out the components of a Top-stage tray sequentially one by one to mount them onto a board, and a third step for, when the components on the tray are exhausted, removing the empty top-stage tray, and then returning to the second step. An apparatus for mounting Components includes a component feed unit for feeding a plurality of stacked-in-stages trays on which components are accommodated, and a pickup device which can selectively hold either a component pickup nozzle or a tray transfer nozzle. The pickup device is movable between the component feed unit and a specified position of a substrate or between the component feed unit and a tray removal box. A nozzle replacement unit is provided for performing replacement of the pickup nozzle and the tray Transfer nozzle. Also, a control unit is provided for deciding whether or not a component is present on the tray, and controlling the pickup head and the nozzle replacement units in such a manner that, if a component is present, picking up the component by the pickup nozzle and placing it onto the substrate, and if no component is present, replacing the pickup nozzle with the tray transfer nozzle, and picking up the tray and removing it to the tray removal box.

Method and apparatus for mounting component

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Osaka, Japan

Wataru Hirai