Ncr Corporation

At&t Global Information Solutions Company

Stromberg-carlson Corporation

Nrc Corporation

Warren W Porter

Donald K Lauffer

Ikuo J Sanwo

Charles B Wall

William F Roosa

Reginald C McNiece

Joseph T DiBene, Ii

Louis W Thies

A high speed test fixture for testing printed circuit board (PCB)-mounted high speed pin grid array (PGA) chips attaches to the solder side (underside) of the PCB to eliminate the need for lead-lengthening adapter sockets. As a result, the testing can be conducted at the actual chip operating speed with reduced noise, rather than at slower speeds required by 'noisy' prior art approaches.

High speed test fixture

A method of affixing heat sink assemblies to integrated circuit devices includes the following steps (1) providing a first heat sink assembly having a first base, with the first base having a first layer of adhesive material disposed thereon, and with a first strippable liner positioned over and in contact with the first layer of adhesive material, (2) removing the first strippable liner from the first layer of adhesive material, (3) positioning the first heat sink assembly in contact with a first integrated circuit device mounted on a printed circuit board such that the first layer of adhesive material is interposed between the first base and the first integrated circuit device, (4) removing the first integrated circuit device from the printed circuit board, (5) providing a second heat sink assembly having a second base, with the second base having a second layer of adhesive material disposed thereon, and with a second strippable liner positioned over and in contact with the second layer of adhesive material, (6) removing the second strippable liner from the second layer of adhesive material, (7) positioning the second heat sink assembly in contact with a second integrated circuit device such that the second layer of adhesive material is interposed between the second base and the second integrated circuit device, and (8) mounting the second integrated circuit device to the printed circuit board. A heat sink assembly having a base, a plurality of thermally conductive fins and a layer of adhesive material disposed on the base is also disclosed.

Heat sink assembly and method of affixing the same to electronic devices

A heat operated release mechanism. The release mechanism is controllable to allow a heat exchanger to be firmly held in place over a heat producing element and effortlessly withdrawn when so desired. A spring is disposed above a heat producing element forming a variable-volume cavity between the spring and the heat producing element. The spring applies pressure to a heat exchanger inserted into the cavity. A memory metal plate is disposed between the spring and the heat exchanger. The memory metal plate has a selectable first shape at a low temperature for allowing the spring to apply pressure to the heat exchanger and a selectable second shape at elevated temperatures for displacing the spring to increase the volume of the cavity. Finally, a controllable heater is disposed between the spring and the memory metal plate for applying heat to the memory metal to select the second shape thereby increasing the volume of the cavity to facilitate insertion and withdrawal of the heat exchanger. Thus, a high spring force is provided while still facilitating insertion and withdrawal of a heat exchanger without the use of tools.

Electrically-operated heat exchanger release mechanism

Resistive ink elements are applied to the exposed surfaces of thin sections or thermal insulation provided to cooled integrated circuit devices within a computer system. The insulation is made thinner than required to prevent the formation of condensation upon the exposed surfaces of the insulation in order to accommodate space limitations within the computer system. The resistive ink elements generate heat upon the application of an electrical current thereto to warm the exposed surfaces of the insulation to a temperature above the dew point of the ambient environment within the computer system, thereby preventing the formation of condensation on the surfaces on the insulation.

Apparatus for preventing the formation of condensation on sub-cooled

An electronic socket pin for use with sub-cooled integrated circuit devices. The socket pin design provides lower thermal conductance and electrical signal path resistance than a traditional electronic socket pin. The improved socket pin has a tubular body formed of an electrically conductive material having a low thermal conductance, such as 304 stainless steel. The tubular body is open at one end, and has a first diameter at the open end, for receiving an integrated circuit device signal lead. The remainder of the length of the tubular body has a second diameter which is much narrower than the first diameter. This narrower cross section further reduces the thermal conductance of the electronic socket pin. A contact sleeve having a cylindrical body including radially inwardly extending, resilient, prongs formed into the wall of the sleeve is fitted over the open end of the electronic socket pin. When fitted over the end of the socket pin, which includes several longitudinal slots formed into the wall of the socket pin, the prongs extend through the slots for engaging an inserted signal lead. The prongs are attached to the lower section of sleeve, away from the open end of the electronic socket pin.

High frequency/low temperature electronic socket pin

A cooling system for a computer system which includes at least one component which generates substantial thermal energy. The cooling system includes a high efficiency heat exchanger formed of a thermally conductive material which is attached to the heat generating component. This heat exchanger comprises a hollow body formed of a thermally conductive material for attachment to the heat generating component, a coolant inlet provided through the wall of the hollow body for providing cooling air from received from an air compressor to the interior of the heat exchanger, and a coolant outlet provided through the wall of the hollow body for providing egress of cooling air from the heat exchanger. Within the hollow body, the exchanger includes a a corrugated metal fin which is periodically lanced to provide for the passage of cooling air through the fin. The metal fin occupies substantially all of the cavity within the heat exchanger's hollow body and is oriented such that the corrugations in the fin are positioned between the heat exchanger's inlet and outlet, providing maximum contact between the cooling air and the surface area of the metal fin.

Focused CPU air cooling system including high efficiency heat exchanger

A cooling system for a computer system which includes at least one component which generates substantial thermal energy. The cooling system includes a heat exchanger formed of a thermally conductive material which is attached to the heat generating component, the heat exchanger including an internal expansion chamber. A first conduit provides a pressurized liquid refrigerant supplied from a refrigeration compressor unit to the expansion chamber, wherein the pressurized liquid refrigerant is evaporated absorbing heat from the heat exchanger and the attached heat generating component. A second conduit provides egress of the evaporated refrigerant from the expansion chamber, returning the evaporated refrigerant to the compressor. The first conduit has a smaller diameter than the second conduit and is placed coaxial with and within the second conduit. The coaxial arrangement of the first and second conduits serves two purposes. The evaporated coolant and the second conduit are heated through thermal contact with the first conduit containing pressurized liquid coolant having a higher temperature than the evaporated coolant, reducing the formation of condensation on the second conduit; and the pressurized refrigerant is pre-cooled prior to evaporation within the expansion chamber through thermal contact with the second conduit containing the evaporated coolant which has a lower temperature than the pressurized liquid coolant.

Computer component cooling system with local evaporation of refrigerant

The present invention provides a modular computer component that inserts into a computer housing. Upon insertion, the component automatically interconnects with a computer in communication with the housing, and the component automatically latches in place relative to the housing. The component can be single-handedly, contemporaneously unlatched from the computer housing, disconnected from a computer in communication with the computer housing, and removed from the computer housing. A latch body secures to the component, and a light conduit conducts light through a portion of the latch body. The mechanism for unlatching the component assumes a standard position relative to the latch body independent of the bias force exerted by the means for latching the component.

Latch assembly for modular computer component

A simple, manual tool for re-aligning lead pins on a pin grid array (PGA) integrated circuit (IC) chip or the like. The tool has a series of removable, parallel bending plates mounted between a top and a base. The bending plates fit between the lead pins to be re-aligned. Re-alignment is accomplished by displacing the top relative to the base (which is stationary), which causes the bending plates to swivel from the base and impinge upon the lead pins at the upper ends of the bending plates. Permanent re-alignment is achieved by bending the lead pins past their elastic limit to a desired point. The top remains parallel to the base at all times. Maximum displacement of the bending plates is limited by an outer skirt when it contacts the base. Four springs bias the tool toward the neutral position. After the lead pins are re-aligned in one direction, the PGA is removed, rotated 90 degrees, and the re-inserted, whereupon the re-alignment routine is performed again to complete the re-alignment process. An adapter plate mounted on the top of the tool accepts PGAs of different sizes.

Mass pin alignment tool

An improved cable connector locking arrangement suitable for D-shell connectors eliminates the standoffs and threaded knobs in standard design and replaces them with tabbed, resilient flanges which snap in place for quick mating and locking of the D-shell connectors. Release bars in the preferred embodiment displace the flanges and hence tabs away from their mating surface for unlocking and disconnection of the connectors.

Cable connector locking arrangement

A cryogenically cooled integrated circuit apparatus is disclosed. The apparatus includes a cryogenic vessel with an integrated circuit package positioned in an opening at one end. One face of the integrated circuit is in direct contact with cryogenic fluid and a second face has a standard pin array which is connectable to a printed circuit board.

Cryogenically cooled integrated circuit apparatus

Methods and apparatus for lowering integrated circuit (IC) chip ambient temperatures allow a slow IC chip to simulate a faster, functionally equivalent one for design testing purposes when the faster chip is not yet available. The cooling devices employed include a cryogenic chip cooling apparatus, and a novel thermo-electric chip cooling apparatus using a directly water-cooled Peltier effect device attached to the surface of the IC chip.

Method and apparatus for low temperature integrated circuit chip testing

A method and apparatus for lowering integrated circuit chip ambient temperatures uses negative pressure to induce cooling liquid flow, rather than prior art positive pressure approaches, thereby preventing undesirable cooling liquid leakage outside of the cooling region. The cooling liquid is deaerated to eliminate performance degrading air bubbles, which are a by-product of the negative pressure approach.

Cooling method and apparatus for integrated circuit chips

A module for insulatively housing and refrigerating a semiconductor device which is designed to be plugged into a printed circuit board within a conventional air-cooled electronic system. The plug-in module is designed such that the semiconductor device within the module can be operated at temperatures from -200.degree. C. down to the temperatures of liquid helium, while a short distance below the housing portion of the module the plug-in conductors connect to a connector on a conventionally cooled processor board. This is accomplished without frost or other type of troublesome moisture forming on the plug-in conductors.

Refrigerated plug-in module

A printed circuit board assembly is disclosed which includes a number of rigid printed circuit boards connected by a number of flexible printed circuit panels. Integrated circuits and similar components are mounted on the rigid printed circuit boards. The components are interconnected by printed circuit conductors of the rigid printed circuit boards and the flexible printed circuit panels. The resulting board assembly can provide a manifold increase in the usable component area over a single flat, rigid printed circuit board when it is folded and installed into a standard cylindrical, coolant filled container.

Growing community of inventors

Escondido, CA, United States of America

Warren W Porter