Samsung Electronics Co., Ltd.

Luminus Devices, Inc.

Warren P Pumyea

Sridhar Sadasivan

Alexei A Erchak

Victoria Hinchey

Michael Hong Lim

Suchit Shah

Hong Lu

Karen Twietmeyer

A light mixing chamber includes a housing having a channel formed therein, with the channel exposed to an exterior of the housing. A chamber is formed in the housing, and an aperture formed in the housing connects the chamber to the channel. The chamber may house an LED, with an optical member being retained within the channel. A light guide plate may be positioned on an exterior of the housing outside the channel.

Light mixing chamber for use with light guide plate

A light mixing chamber of a backlight includes a housing having a channel and a chamber exposed to the channel, an LED positioned within the chamber, and a capillary containing quantum dots positioned in the channel. A light guide plate is positioned adjacent the housing and adjacent the capillary. Relative dimensions of the elements of the light mixing chamber, as well as features added to the elements of the light mixing chamber, can be varied to balance efficiency and uniformity of light generated in the backlight.

Light mixing chamber for use with color converting material and light guide plate and assembly

Light-emitting devices are described herein. Some embodiments relate to light-emitting diodes with light-emitting sections that are independently electrically addressable. The devices may be used in a variety of applications including illumination and general lighting.

Light-emitting device including independently electrically addressable sections

A method, and associated apparatus, for attaching a component (e.g., an electronic and/or optoelectronic component) is provided which can facilitate low-voiding of an attachment layer. The method includes disposing an attachment material layer over a surface, providing the component having a backside surface, disposing a portion of the backside surface of the component over a first portion of the attachment material layer such that a substantial portion of the backside surface of the component is not disposed over the attachment material layer, and moving the component such that the component is attached to at least a portion of the attachment material layer that is substantially larger than the first portion of the attachment material layer. The attachment material can include a solder. A light-emitting device is also described that comprises a component including a light-emitting die, wherein the component is supported by a substrate, and wherein the light-emitting die comprises a light emission surface and a backside surface disposed opposite the light emission surface. The light emission surface of the light-emitting die has an area greater than or equal to 1 mmand an attachment material layer is disposed between the backside surface of the light-emitting die and the substrate, wherein the attachment material layer has voiding of less than 5% of an area of the backside surface.

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Gardner, MA, United States of America

Warren P Pumyea