Cascade Microtech, Inc.

Hewlett-Packard Development Company, L.p.

Cascase Microtech, Inc.

Warren K Harwood

Paul A Tervo

Randy J Schwindt

Richard H Warner

Kenneth R Smith

Martin J Koxxy

Keith E Jones

Peter Douglas Andrews

Luke P Sosnowski

Peter J Boucher

Daniel DeLessert

Jason Young Carothers

Jason Y Carothers

Examples described herein include examples print media handling system including a first media guide assembly comprising a sensor assembly, and a second media guide assembly comprising a retractable pressure plate and disposed opposite the first media guide assembly to guide a print media along a path between the first media guide assembly and second media guide assembly, the pressure plate moveable about an axis perpendicular to the path between an actuated position and a retracted position.

Print media pressure plates

A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.

Wafer probe station having environment control enclosure

A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times. With similar operation and effect, where any signal line element of the connector mechanism is arranged exterior of its corresponding guard line element, such as adjacent the chuck assembly or on the probe-holding assembly, a guard enclosure is provided to surround and fully guard such signal line element in interposed relationship between that element and the outer shielding enclosure.

Wafer probe station having a skirting component

Wafer probe station for low-current measurements

Growing community of inventors

Vancouver, WA, United States of America

Warren K Harwood