International Business Machines Corporation

Other

Warren D Grobman

Da-Yuan Shih

Jerry E Hurst, Jr

Leon L Wu

Herbert I Stoller

John J Ritsko

Paul H Palmateer

Yaffa Tomkiewicz

Timothy W Carr

Derry J Dubetsky

John M Warlaumont

Walter F Lange

Carl P Hayunga

David W Boss

Charles J Kraus, Deceased

George M Greenstein

Robert H Massey

John A Romano

Amanda H Kumar

David A Nelson, Jr

By Paula Kraus, Executrix

Fahfu Ho

A electronics system and method are provided which allow engineering changes to be made to a substrate without requiring the addition of fly wires and without requiring relatively large areas of pads for attaching these wires. Each device site is surrounded by a series of engineering change ring patterns. A series of engineering change patterns allow change interconnections between device sites to be made. Fan-in metallizations extend inwardly to the device sites from these change patterns, with a series of vias making surface connections adjacent to the ring patterns. Fan-out metallizations extend from the device site pads to the ring patterns, with a series of vias making surface connections adjacent to the ring patterns. Engineering changes are made by directly writing surface metal deposits to make the appropriate connections between the vias and the ring pattern. The original chip pad connections and the new ring pattern connections can be appropriately isolated by laser deletions, if necessary.

Electronics system with direct write engineering change capability

Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

Sealing and stress relief layers and use thereof

A method of radiation induced dry etching of a metallized (e.g. copper) substrate is disclosed wherein the substrate is pattern-wise exposed to a beam of laser radiation in a halogen gas atmosphere which is reactive with the substrate to form a metal halide salt reaction product to accelerate the formation of the metal halide salt without its substantial removal from the substrate. The metal halide salt is removed from the substrate by contact of the substrate with a solvent for the metal halide salt.

Laser stimulated halogen gas etching of metal substrates

In electron beam testing systems wherein high energy, high resolution electron beams are used to test lithographic masks, a technique and apparatus are described for discharging electrons which are left on the surface of the mask, and which alter the input trajectory of the electron beam. The materials used in these masks are such that induced photoconductivity and photoemissivity are extremely low and are incapable of providing sufficient electron discharge. A thin, low work function coating is applied over the entire mask surface, the coating being transparent to the radiation which will later be incident upon the mask when it is used in a fabrication process. Due to induced photoemission in the thin coating layer, enough photoemitted electrons will be produced to balance the buildup of electrons from the electron beam, thereby discharging the surface of the mask. The electron beam is a high energy beam, having energies greater than about 5000 eV, and a resolution less than about 1 micrometer.

Electron beam system with reduced charge buildup

A physical barrier is provided for debris discharged from any pulsed electromagnetic radiation source. A shutter is positioned in the path of the electromagnetic radiation at a distance sufficiently far from the source of the electromagnetic radiation such that an emitted pulse of electromagnetic radiation and the debris simultaneously discharged with the pulse become spatially separated from each other and arrive at the shutter at different times due to the inherent difference in propagation speed of the debris and pulse. Movement of the shutter is synchronized with generation of an electromagnetic pulse such that the electromagnetic pulse encounters an open shutter while the slower travelling debris simultaneously launched with the pulse encounters a closed shutter.

Pulsed electromagnetic radiation source having a barrier for discharged

Fine alignment of mask and wafer, using Fresnel zone plates is achieved. Light is focused on the wafer by a zone plate in the mask. Light diffracted from a zone plate on the wafer is received by a sensor. The received light is coded (analog or digital) to indicate alignment. For analog coding the wafer zone plate diffracts light to the sensor from an area of the wafer zone plate which is indicative of alignment. For digital coding, the wafer zone plate is digitally encoded as a function of alignment to similarly code the diffracted light. To eliminate ambiguity, the mask zone plate is formed from a plurality of 'elements', each of which is itself a Fresnel zone plate. The focal length of the elemental Fresnel zone plate can be related to the mask/wafer separation distance, whereas the focal length of the macro zone plate (made up of a plurality of the elemental zone plates) is related to the distance between mask and light sensor.

Alignment method and apparatus for x-ray or optical lithography

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Yorktown Heights, NY, United States of America

Warren D Grobman