Amp LLC

Warren C Jones

Ronald A Dery

John R Rowlette

James L Joyce, Jr

David F MacInnes, Jr

John P Redmond

William J Lynn

Navin N Vyas

William G Gentry

Clifton C May, Jr

Steven G Wentink

A method and product for providing an electrical interconnection between components and a substrate includes the use of an adhesive coating. The coating (40,42) is applied between the contacts (14,22) of component and substrate and the surface of a conductive fiber-filled, elastomeric connector (30) and is operable to bond the contacts to the surfaces of the connector with conductive fibers (34) of the connector piercing the adhesive coating to provide multiple contacts (36,38) and define current paths for the interconnection while mechanically bonding connectors, components, and substrate together. Protective covers (44) are applied to connectors to protect the adhesive coatings prior to use with sheets (50) or rolls (52) alternatively used to carry arrays of connectors in patterns corresponding to substrate contacts (14,22).

Fiber-filled elastomeric connector attachment method and product

The compound ortho-methoxyaniline (o-anisidine) can be polymerized by both chemical and electrochemical means to produce polyanisidine, a soluble polymer of high electrical conductivity. Also called poly-o-methoxyaniline or PANIS, polyanisidine can be further blended with various other polymers enabling construction of devices with desirable electrical, optical and physical properties. Oxidative polymerization yields have been increased to 47 percent with no apparent loss in electrical conductivity. PANIS has been blended with polystyrene, polyacrylonitrile, polyethylene oxide and poly(trimethyl hexamethylene terephthalamide) (nylon) to form free-standing, stable, flexible films and fibers having electrical resistance values dependent upon the concentration of PANIS. The applicability of PANIS technology has been demonstrated with the construction of three devices: a switching device that will change color upon the application of positive and negative voltages, an inert polymer electrode, and an electromagnetically shielded connector.

Inert electrode comprising a conductive coating polymer blend formed of

This invention is directed to an electrically conductive gel comprising an extrinsically conductive gel having dispersed therein a quantity of an intrinsically conductive polymer, where said polymer is present in the amount of between about 0.03 to 1.6%, by weight. Preferred conductive polymers are those selected from the class of polypyrrole, polyaniline, polyanisidine, polythiophene, and derivatives of these base polymers.

Extrinsically/intrinsically conductive gel

An anisotropically conductive adhesive composition (10) for use in electrically connecting at least one conductive area (14) on one substrate (12) with at least one conductive area (20) on a second substrate (18) is disclosed. The composition (10) is comprised of a mixture of conductive particles and a nonconductive adhesive binder (26). The conductive particles are dispersed throughout the binder in a plurality of noncontiguous conductive units (24) such that, upon applying a layer (30) of the composition (10) over both the conductive and insulating areas (14, 16) on one substrate (12) and positioning in a conducting relationship and adhering said at least one conductive area (20) on the second substrate (18) with said at least one conductive area (14) on the first substrate (12), the units (24) establish electrical connection between the adhered conductive areas (14, 20) on the two substrates (12, 18). The units (24) are sufficiently spaced apart, however, to preclude electrical conductivity between adjacent areas on the same substrate. A method for electrically connecting conductive areas on two substrates by means of said anisotropically conductive adhesive composition (10) and products produced by said method are also disclosed.

Anisotropically conductive adhesive composition

A flat multiconductor cable having a multilayer construction and especially suited for use in establishing interconnections between the cable conductors and a separate conductive array such as a similar flat cable is disclosed. Conductive ink, formed metal conductors or etched conductors can be deposited on a flexible substrate and covered by a dielectric covering in the form of an ultraviolet cured dielectric coating or a separate insulating film. The conductors can be covered by anisotropic conductive adhesive with the conductive adhesive in contact with the underlying conductors at exposed tap locations where no dielectric coating is deposited or where the dielectric coating has been removed. A separate conductive array can be positioned in registry with the tap locations and the conductive adhesive can be used both to secure the conductive array to the cable and to establish electrical continuity between corresponding conductors.

Flexible flat multiconductor cable

An adhesive interconnecting means is comprised of one or more conductors on an insulating substrate, a first adhesive layer, said first layer being anisotropically conductive and disposed over said conductors and substrate and a second adhesive layer said second layer being a flowable adhesive that extends over the first substrate and anisotropically conductive layer. The anisotropically conductive adhesive is comprised of a nonhomogenous mixture of conductive particles in a nonconductive adhesive binder; the conductive particles, of random size and shape, are dispersed randomly throughout the mixture in noncontiguous conductive units, each unit being comprised of one or more individual particles, the units being sufficiently spaced apart to preclude electrical conductivity between adjacent conductive areas on the same substrate. The flowable adhesive extends over the surface of the first substrate and conductive units to provide insulation whereby upon positioning the first substrate conductors in an overlapping conducting relationship to the second substrate conductors and applying pressure to the positioned areas, the adhesive flows from the positioned areas and exposes the conductive units thus bringing the exposed units into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface of the surface of the second substrate.

Adhesive electrical interconnecting means

An interconnecting means is comprised of one or more conductive ink conductors screen printed onto a first substrate, the conductive ink being comprised of an insulating polymer medium having first and second groups of conductive particles therein, and an insulating layer of flowable adhesive in covering relationship to the conductors. The first group of particles are finely divided particles which are suspended in the medium and form a continuous conductive path along the length of the conductor. The second group of particles are agglomerates of large particles which are randomly scattered throughout the conductive path and project above the surface of the medium. Interconnection is effected by positioning the first substrate conductors in an overlapping conducting relationship to the conductors on the second substrate such that the flowable adhesive is deposited between the two substrates and applying pressure to the positioned conductors and surrounding areas. The adhesive flows from the positioned areas, exposes the protruding agglomerates, thus bringing the agglomerates into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface to the surface of the second substrate.

Electrical interconnection means

An adhesive interconnecting means is comprised of one or more conductors on an insulating substrate, a first adhesive layer, said first layer being anisotropically conductive and disposed over said conductors and substrate and a second adhesive layer said second layer being a flowable adhesive that extends over the first substrate and anisotropically conductive layer. The anisotropically conductive adhesive is comprised of a nonhomogenous mixture of conductive particles in a nonconductive adhesive binder; the conductive particles, of random size and shape, are dispersed randomly throughout the mixture in noncontiguous conductive units, each unit being comprised of one or more individual particles, the units being sufficiently spaced apart to preclude electrical conductivity between adjacent conductive areas on the same substrate. The flowable adhesive extends over the surface of the first substrate and conductive units to provide insulation whereby upon positioning the first substrate conductors in an overlapping conducting relationship to the second substrate conductors and applying pressure to the positioned areas, the adhesive flows from the positioned areas and exposes the conductive units thus bringing the exposed units into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface to the surface of the second substrate.

Method of making adhesive electrical interconnecting means

An interconnecting means is comprised of one or more conductive ink conductors printed onto a first substrate, the conductive ink being comprised of an insulating polymer medium having first and second groups of conductive particles therein, and an insulating layer of flowable adhesive in covering relationship to the conductors. The first group of particles are finely divided particles which are suspended in the medium and form a continuous conductive path along the length of the conductor. The second group of particles are agglomerates of large particles which are randomly scattered throughout the conductive path and project above the surface of the medium. Interconnection is effected by positioning the first substrate conductors in an overlapping conducting relationship to the conductors on the second substrate such that the flowable adhesive is deposited between the two substrates and applying pressure to the positioned conductors and surrounding areas. The adhesive flows from the positioned areas, exposes the protruding agglomerates, thus bringing the agglomerates into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface to the surface of the second substrate.

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Winston-Salem, NC, United States of America

Warren C Jones