Western Digital (fremont), Inc.

Wanxue Zeng

Ying Hong

Weimin Si

Lieping Zhong

Zhigang Bai

Various embodiments described herein provide for substrate structures including uniform plating seed layers, and that provide favorable adhesion on dielectric substrate layers. According to some embodiments, a methods for forming a magnetic recording pole is provided comprising: forming an insulator layer; forming a trench in the insulator layer; forming an amorphous seed layer over the insulator layer; forming an adhesion layer over the amorphous seed layer, the adhesion layer comprising a physical vapor deposited (PVD) noble metal; forming a plating seed layer over the adhesion layer, the plating seed layer comprising chemical vapor deposited (CVD) Ru; and forming a magnetic material layer over the plating seed layer.

Methods for improving adhesion on dielectric substrates

Systems and methods for fabricating a microelectric device are provided herein. Various embodiments provide for systems and methods for fabricating a magnetic recording pole using plasma-enhanced chemical vapor deposition (PECVD) when depositing seed material. For some embodiments, fabrication of the magnetic recording pole may comprise using plasma-enhanced chemical vapor deposition (PECVD) Ru as an adhesion layer for a plating seed layer.

System and method for deposition in high aspect ratio magnetic writer heads

A writer main pole for a perpendicular magnetic recording system is provided. The writer pole has a tunable bottom gap to side gap ratio, and may be formed using deposition of a first seed layer through an ion beam deposition process, deposition of a second seed layer through a physical vapor deposition process, and deposition of a non-magnetic gap layer through a chemical vapor deposition process.

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Pleasanton, CA, United States of America

Wanxue Zeng