Applied Materials, Inc.

Globalfoundries Inc.

Wangkeun Cho

Gene S Lee

Dongsuk Park

Wen Hua Cheng

Embodiments described herein generally relate to electronic devices and electronic device manufacturing. More particularly, some embodiments of the present disclosure provide methods of manufacturing memory devices, for example, dynamic random-access memory cells with buried word-lines. In an embodiment, a method of manufacturing an electronic device is provided. The method includes recessing a metal layer to a first predetermined depth to form a recessed metal layer. The metal layer at least partially fills each feature of a plurality of features formed on a substrate and each feature has a feature depth. The method further includes exposing the recessed metal layer to a carbon-containing plasma to form a metal-carbide layer on the recessed metal layer. The method further includes recessing the recessed metal layer to a second predetermined depth by etching the metal-carbide layer and the recessed metal layer.

Recessed metal etching methods

Methods and processes for forming semiconductor devices with reduced yield loss and failed dies are provided. One method includes, for instance: obtaining a wafer after at least one fabrication processing; taking first r, &#x3b8;, z measurements of the wafer after the at least one fabrication processing; performing at least one second fabrication processing; taking second r, &#x3b8;, z measurements of the wafer after the at least one second fabrication processing; and analyzing the second r, &#x3b8;, z measurements with respect to the first r, &#x3b8;, z measurements. A process includes, for instance: obtaining a wafer with a substrate and at least one first device positioned on the substrate; taking first measurements in a r, &#x3b8;, z coordinate system; forming at least one second device over the substrate; taking second measurements in the r, &#x3b8;, z coordinate system; and analyzing the second measurements with respect to the first measurements.

Growing community of inventors

Mechanicville, NY, United States of America

Wangkeun Cho