Hisense USA Corporation

Hisense International Co., Ltd.

Hisense Electric Co., Ltd.

Hisense Hiview Tech Co., Ltd.

Wangjun Zhang

Yong Zhang

Dejun Wang

Haode Jiang

A double-layer injection molding casing and a method for manufacturing the same, an electronic apparatus are provided by this invention, which adapts to an injection molding field and can solve the problems of a conventional double-layer injection molding casing such as complicated manufacturing process and low production efficiency. The double-layer injection molding casing of this invention includes an outer layer and an inner layer. A locating structure integrally formed with the inner layer is located at an inner surface of the inner layer. The method for manufacturing the double-layer injection molding casing includes: applying a multiple injection molding process, wherein the locating structure of the double-layer injection molding casing is integrally formed with the inner layer in the same injection molding step. The electronic apparatus of this invention includes the double-layer injection molding casing. The double-layer injection molding casing can be used as a casing of the electronic apparatus.

Double-layer injection molding casing and method for manufacturing the same, electronic apparatus

A back housing applicable to a curvature-adjustable display device is disclosed, wherein the back housing includes at least three housing bodies which are vertically arranged, the housing bodies are connected by at least two types of housing connectors including a rotating connector and a sliding connector, and the housing connector between adjacent housing bodies is one of the rotating connector and the sliding connector, and wherein the rotating connector is configured to have two adjacent housing bodies connected through rotation, and the sliding connector is configured to have two adjacent bodies connected through sliding.

Back housing and display device

Growing community of inventors

Qingdao, China

Wangjun Zhang