Planetart, LLC

Semiconductor Manufacturing International (Shanghai) Corporation

Wang Ping

Zhang Jun

Erik Malkemus

Roger Bloxberg

Adam Black

Fan Xiang

Chin Chang Liao

Waisum Wong

Zhang Xui Hao

A device and algorithm for allowing a customer to choose a photo book cover template that is compatible with a photo having faces. The photo is compared with a set of templates arranged in a first order to determine how compatible the photo is to each of the templates, and a score indicative of compatibility is assigned. A re-sorted set of compatible templates combined with the photo is presented to the customer for consideration.

Custom recommendations application for creating photo book cover

Custom recommendation application for creating photo book cover

System and method for test structure on a wafer. According to an embodiment, the present invention provides a test structure for testing an integrated circuit. For example, the test structure and the integrated circuit are manufactured on a same substrate material and the testing being conducted is in a temperature-controlled environment. The test structure includes a top structure positioned above the integrated circuit, the top structure including a first metal material, which includes a first electrical terminal and a second electrical terminal. The test structure also includes a bottom structure positioned below the integrated circuit, the bottom structure including a first silicon material. A first side structure is positioned between the top structure and the bottom structure and located next to a first side of the integrated circuit. A second side structure is positioned between the top structure and the bottom structure and located next to a second side of the integrated circuit.

System and method for test structure on a wafer

System and method for test structure on a wafer. According to an embodiment, the present invention provides a test structure for testing a chip. For example, the test structure and the chip are manufactured on a same substrate material and the testing being conducted is in a temperature-controlled environment. The test structure includes a top structure positioned above the chip. For example, the top structure can be characterized by a first surface area. The top structure includes a first metal material occupying less than 60% of the surface area. The test structure also includes a bottom structure positioned below the chip. For example, the bottom structure can be characterized by a second surface area. The second surface area is substantially equal to the first surface area. The bottom structure includes a first silicon material. The first silicon material occupies substantially all of the second surface area.

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Shanghai, China

Wang Ping