Motorola Corporation

Other

Wang-Chang A Gu

Richard S Kommrusch

Robert E Stengel

Gustavo Dario Leizerovich

Jenn-Hwa Huang

Rong-Fong Huang

Lawrence F Cygan

Feng Niu

Chowdary Ramesh Koripella

Anthony M Pavio

E S Ramakrishnan

Robert A Burr

Adam D Moya

A microelectromechanical system (MEMS) switch assembly ( ) and a method of forming the MEMBS switch assembly ( ) is provided that includes a switching member ( ) having a first portion ( ) that is at least partially formed with a first material having a first dielectric constant and a second portion ( ) that is at least partially formed with a second material having a second dielectric constant. Furthermore, the switching member ( ) further includes a first lead ( ) spaced apart from a second lead ( ) for contacting the switching member ( ). In operation, the switching member ( ) is configured for movement such that the first portion ( ) and second portion ( ) of the switching member ( ) can provide variable electrical connections between the first lead ( ) and second lead ( ).

Switch assembly and method of forming the same

An integrated filter circuit and a method of fabrication are disclosed, wherein the integrated filter has an input and an output parasitic shunt impedance. Input and output electrical components are coupled to the input and output terminals, respectively, to reduce the input and output parasitic shunt impedances. The input and output electrical components each include one of a coil, a section of transmission line, a coil and tuneable capacitance connected in a series tuned circuit, or a coil and tuneable capacitance connected in a parallel tuned circuit. The integrated filter includes input and output multilayer ceramic integrated coils which may be positioned so that capacitive coupling between the coils substantially cancels inductive coupling therebetween, and/or an interlayer gridded ground wall is positioned between the input and output coils

Integrated filter with improved I/O matching and method of fabrication

A tunable inductor circuit and phase tuning circuit utilizing a tunable inductor circuit for dynamically controlling signal phase delay in RF/Microwave Circuits and related applications. The tunable inductor includes an inductor and a voltage variable capacitor connected to each other. The tunable inductor and voltage variable capacitor can be connected to each other in parallel or in series. The phase tuning circuit includes at least one tunable inductor circuit and at least one voltage variable capacitor coupled to the at least one tunable inductor circuit, wherein the at least one tunable inductor circuit and the voltage variable capacitor are responsive to control signals to alter a tuning characteristic of the phase tuning circuit.

Tunable inductor circuit, phase tuning circuit and applications thereof

A power amplifier includes a carrier amplifier path and a peaking amplifier path. The carrier amplifier path includes a carrier amplifier (,), and an impedance transforming network (,). The peaking amplifier path includes a peaking amplifier (,), an impedance transforming network (,), and a phase delay quarter wave element (,). The arrangement forms an inverted Doherty combiner where as the nominal impedance at a summing node (,) increases with increased conduction from the peaking amplifier, the load impedance at the output of the carrier amplifier decreases so as to maintain the carrier amplifier at a saturation point as the input signal (,) increases, and results in a reduction of the number of phase delay elements needed over a conventional Doherty approach. In a preferred embodiment the carrier and peaking amplifiers consist of cascaded stages, and are disposed on a common integrated circuit die (,). The impedance transforming networks and phase delay element are disposed on a common substrate (,), as is an input splitter network (,).

High efficiency power amplifier having reduced output matching networks for use in portable devices

A radio frequency (RF) choke inductor (102, 500, 600) includes a magnetic core (502, 602) which substantially dissipates RF and microwave signals. The magnetic core (502, 602) is sufficiently lossy to provide a substantially resistive impedance at RF and microwave frequencies. The magnetic core is formed by providing a homogeneous ferrite composition characterized by a mixture of ferrous ions and ferric ions (404), and then sintering the homogeneous ferrite composition in an inert gas atmosphere (412) to provide a rapid electron exchange reaction. A conductive wire is then wound about the magnetic core (414) to complete the choke inductor.

RF choke with a low Q core formed by sintering ferrous and ferric oxides

A volume efficient resonator (100) includes a helical coil transmission line (108) fabricated on a plurality of dielectrics (212, 214, 216, 218, 220, 222, 224, and 226). The transmission line (108) includes selectively metalized areas (210) on the dielectric layers. The metalized areas are formed in half loops and interconnected at alternate terminals via through-holes (203 and 205). A distributed capacitor (106) is added to the transmission line (108) using another set of selectively metalized areas (208). The distributed capacitor (106) is shunted to a ground plane (202) via through-holes (204, 206).

Volume efficient resonator

First and second transmission line couplers (202, 204) one being configured in an asymmetrical open circuit configuration, the other being configured in an asymmetrical short circuit configuration, are coupled together to form a balun transformer (200). Balun transformer (200, 400, 500) can be implemented in three port bandpass filter (800) or other differential circuits to combine the functionality of a balun transformer and a two-pole filter into one circuit.

Balun transformer

A multi-layer substrate (500) includes a segmented stripline (602) which is formed of multi-layered segment (514, 522, 516) and is proximately coupled to a second stripline (604) to form a directional coupler. The directional coupler (500) provides similar input and output port impedances while allowing for independent control of the coupling. The overall length of the coupler is held constant while individual lengths of the segments of the segmented stripline (602) and the second stripline (604) are increased and decreased to independently control the coupling while maintaining the similar port impedances.

Directional coupler and method of forming same

A high Q multi-layer ceramic transmission line resonator (100) used for RF applications. The resonator (100) includes a plurality of strips (102) which are separated by a ceramic substrate (104). Each of the strips are interconnected using vias (110) passing through the ceramic substrate (104). The invention utilizes current manufacturing processes to fabricate an equivalent thick center conductor to effectively increase the Q factor. This allows for the resonator to be used in miniature RF communication devices utilized in high tier devices such as voltage controlled oscillators (VCOs) or integrated filter circuits.

High-Q multi-layer ceramic RF transmission line resonator

A transmission line device (200) employs a first ground plane (118) that is disposed on a first dielectric substrate (202). A first conductive layer (210) that encloses a first area (213)is disposed on a second dielectric substrate (206), which substrate is positioned substantially adjacent to the first dielectric substrate (202). A second conductive layer (211) that encloses an area corresponding to the first area (213) is disposed on a third dielectric substrate (207), which substrate is positioned substantially adjacent to the second dielectric substrate (206). A coil structure is thereby provided that can be employed in the fabrication of a transmission line device, according to the invention.

Transmission line device using stacked conductive layers

An electrical circuit (400) includes a first input means (401) for providing an input signal, a first output means (406) for providing an output signal, and a transmission line device (405) electrically positioned between the first input means (401) and the first output means (406). The first transmission line device includes a first ground plane (409) disposed on a first dielectric substrate (402), a first conductive layer (405-1) enclosing a first area on a second dielectric substrate (403) that is positioned substantially adjacent to the first dielectric substrate (402). The transmission line device (405) further includes a second conductive layer (405-2) that encloses an area corresponding to the first area on a first major surface of a third dielectric substrate (404) that is positioned substantially adjacent to the second dielectric substrate. Lastly, an embedded ground plane (411) is disposed on a fourth dielectric substrate (412)that is positioned substantially between the second dielectric substrate (403) and the third dielectric substrate (404 ).

Embedded ground plane for providing shielded layers in low volume

An electrical circuit (500) includes an input means (503) for providing an input signal, an output means for providing an output signal, and a transmission line device (421) disposed substantially between the input means (503) and the output means. The transmission line device inludes a first ground plane (505) disposed on a first dielectric substrate (502), and a first conductive layer (421-1) disposed, and enclosing a first area, on a second dielectric substrate (506) that is positioned substantially adjacent to the first dielectric substrate (502). The transmission line device (421) further includes a second conductive layer (421-2) that encloses an area corresponding to the first area on a first major surface of a third dielectric substrate (504) that is positioned substantially adjacent to the second dielectric substrate (506).

Growing community of inventors

Albuquerque, NM, United States of America

Wang-Chang A Gu