Rohm & Haas Electronic Materials LLC

Rohm and Haas Electronics LLC

Rohm and Haas Elcetronic Materials LLC

Rohm and Haas Electroncis Materials LLC

Wan Zhang-Beglinger

Margit Clauss

Jonas Guebey

Katharina Weitershaus

Andreas Scheybal

Adolphe Foyet

Michael P Toben

Yi Qin

Christos Comninellis

Felix J Schwager

André Egli

Julia Woertink

Jan Fransaer

Jonathan D Prange

Pedro O Lopez Montesinos

Edit Szöcs

Linda Stappers

Cyanide-free acidic silver electroplating compositions include one or more acids or salts of tellurium and may be used to electroplate matte silver deposits on metals, such as nickel, copper or copper alloys. Matte silver metal may be electroplated at conventional plating rates or at high plating rates, such as in reel-to-reel and jet plating. The cyanide-free acidic silver electroplating compositions may be used to electroplate matte silver in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, optical devices and decorative applications.

Cyanide-free acidic matte silver electroplating compositions and methods

Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Electroplating baths of silver and tin alloys

The plastisol coated plating tools are used to secure polymer containing substrates in electroless plating baths during electroless plating of the polymers. To prevent metallization of the plastisol coated plating tools during electroless metallization, compositions of sulfur compounds are applied to the plastisol. After metallization the plastisol coated plating tools may be re-used without the need to strip the unwanted metal from the tools.

Metallization inhibitors for plastisol coated plating tools

A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.

High speed method for plating palladium and palladium alloys

A chrome-free acidic aqueous solution of sulfuric acid and one or more organic acids and manganese (II) and (III) ions is applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.

Chrome-free methods of etching organic polymers with mixed acid solutions

White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.

Adhesion promotion of cyanide-free white bronze

A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.

Method of preventing silver tarnishing

A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

High temperature resistant silver coated substrates

Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.

Anti-displacement hard gold compositions

A cyanide-free silver electroplating solution may be used to electroplate mirror bright silver layers at high current density ranges and at high temperatures such as in reel-to-reel electroplating. The cyanide-free silver electroplating solution is environmentally friendly.

Cyanide-free silver electroplating solutions

A chrome-free composition of an acidic suspension of manganese compounds and manganese ions are applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.

Growing community of inventors

Adligenswil, Switzerland

Wan Zhang-Beglinger