Au Optronics Corporation

Wan-Tsang Wang

Yung-Chih Chen

Chun-Hsin Liu

Tsung-Ying Ke

Keh-Long Hwu

Li-Chih Hsu

Ya-Ting Hsu

Wan-Lin Chen

Chih-Ling Hsueh

A display panel including a first array substrate, a first pad, and a second pad is provided. The first array substrate includes a first substrate, a first active element, a first display element, and a second display element. The first active element is disposed on the top surface of the first substrate. The first display element and the second display element are disposed on the top surface of the first substrate. The first display element is electrically connected to the first active element. The first pad and the second pad are disposed on the bottom surface of the first substrate. The first active element is electrically connected to the first pad. Each of the first pad and the second pad includes an embedded part and a protruded part. The embedded part is located in the first substrate. The protruded part is protruded from the bottom surface of the first substrate.

Manufacturing method of display panel having pad comprising embedded part and protruded part

A flexible display including a buffer layer, a plurality of pixel structures, a plurality of first pads, a plurality of first conductive through holes, a flexible circuit board and an adhesive layer is provided. The pixel structures are disposed on a first surface of the buffer layer. The first pads are disposed on a second surface of the buffer layer. The first conductive through holes are embedded in the buffer layer. The first pads are respectively electrically connected to the pixel structures through the first conductive through holes. The adhesive layer is disposed between the second surface of the buffer layer and the flexible circuit board. An orthogonal projection of the adhesive layer on the buffer layer overlaps an orthogonal projection of the pixel structures on the buffer layer. The first pads are electrically connected to first signal lines of the flexible circuit board.

Flexible display

The disclosure provides a display panel including first pixel structures, second pixel structures, first signal lines, second signal lines, a first driving circuit, and a second driving circuit. The first signal lines and the first pixel structures are disposed in a first display area and electrically connected. The second signal lines and the second pixel structures are disposed in a second display area and electrically connected. The first display area and the second display area are arranged in a first direction. The first signal lines and the second signal lines are arranged in a second direction. The first direction and the second direction are perpendicular. The first signal lines and the second signal lines are structurally separated. The first drive circuit is electrically connected to the first signal lines. The second driving circuit is electrically independent from the first driving circuit and electrically connected to the second signal lines.

Display panel

A display panel including a first array substrate, a first pad, and a second pad is provided. The first array substrate includes a first substrate, a first active element, a first display element, and a second display element. The first substrate has a top surface and a bottom surface disposed opposite to each other. The first active element is disposed on the top surface of the first substrate. The first display element is disposed on the top surface of the first substrate and is electrically connected to the first active element. The second display element is disposed on the top surface of the first substrate and is disposed separately from the first display element. The first pad and the second pad are disposed on the bottom surface of the first substrate, wherein the first active element is electrically connected to the first pad, each of the first pad and the second pad includes an embedded part and a protruded part, the embedded part is located in the first substrate, and the protruded part is protruded from the bottom surface of the first substrate.

Display panel having pad disposed on bottom surface of substrate and manufacturing method thereof

A display device includes a pixel circuit substrate, a plurality of light emitting devices, a driver circuit substrate, a plurality of connection terminals, and an electrically conductive adhesion layer. The light emitting devices are electrically connected to the pixel circuit substrate. The driver circuit substrate is disposed on a back side of the pixel circuit substrate. The connection terminals electrically connect the driver circuit substrate to the pixel circuit substrate. The electrically conductive adhesion layer is disposed between the pixel circuit substrate and the driver circuit substrate.

Display device

A display device including a first substrate, pixel structures, a second substrate, first signal lines, and second signal lines is provided. The pixel structures are disposed on a first surface of the first substrate. Each of the pixel structures includes a switch element and a pixel electrode. The switch element has a first terminal, a second terminal, and a control terminal. The pixel electrode is electrically connected to the second terminal of the switch element. The second substrate is disposed under a second surface of the first substrate. The first signal lines and the second signal lines are disposed on the second substrate. The first terminals and the control terminals of the switch elements of the pixel structures are respectively electrically connected to the first signal lines and the second signal lines, wherein the first signal lines are substantially parallel to the second signal lines.

A manufacturing method of a light-emitting device including the following steps is provided. A test trace and a first signal trace are formed on a first substrate. A light-emitting element electrically connected to the test trace and the first signal trace is formed. A test procedure is performed on the light-emitting element via the test trace and the first signal trace. An encapsulation layer is formed on the first substrate to cover the light-emitting element. The test trace is removed, and then a driving unit electrically connected to light-emitting element is formed.

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Hsinchu, Taiwan

Wan-Tsang Wang