Siliconware Precision Industries Co., Ltd.

Au Optronics Corporation

Wan-Ting Chen

Chun-Tang Lin

Mu-Hsuan Chan

Yi-Che Lai

Yi-Chian Liao

Sheng-Ju Ho

Cheng-Han Tsao

Shu-Wen Liao

Chih-Chang Shih

Chi-Hsien Chung

Tzu-Fang Huang

Yi-Chi Lai

Yang-Ching Cheng

A semiconductor package is provided, which includes: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top surface of the interposer; a redistribution layer formed on the encapsulant and the top surface of the interposer; and at least a semiconductor element disposed on the redistribution layer. The top surface of the interposer is flush with a surface of the encapsulant so as for the redistribution layer to have a planar surface for disposing the semiconductor element, thereby preventing warpage of the interposer and improving the reliability of electrical connection between the redistribution layer and the semiconductor element.

Semiconductor package and fabrication method thereof

A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element.

Method of fabricating semiconductor package

Semiconductor package and method of fabricating the same

The present invention provides a liquid crystal lenticular lens including a first substrate, a second substrate, a liquid crystal layer, two first electrodes, two second electrodes, and a common electrode. The second substrate and the first substrate are disposed opposite to each other. The liquid crystal layer is disposed between the first substrate and the second substrate, and the liquid crystal layer has an ordinary refractive index and an extraordinary refractive index. The first electrodes and the second electrodes are disposed between the first substrate and the liquid crystal layer, and the second electrodes are disposed between the first electrodes. The common electrode is disposed between the second substrate and the liquid crystal layer.

2D and 3D switchable display device and liquid crystal lenticular lens thereof

A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability.

A video-audio playing system relating to 2-view application and a method thereof are provided. In the present invention, sound signals respectively corresponding to two independent image frames are captured and played in coordinating with the displaying of these two independent image frames. Accordingly, two users can respectively watch two image frames which are different and irrelevant each other in the same display, and further respectively hear sound effects of the respective image frames at the same time.

Video-audio playing system relating to 2-view application and method thereof

Growing community of inventors

Taichung, Taiwan

Wan-Ting Chen