Samsung Electronics Co., Ltd.

Wan-Sub Lee

Ki-Seon Kim

A display apparatus using clamps for coupling an electron gun unit with a video unit is provided. The display apparatus may be constructed using a panel on which a picture is displayed, a funnel fastened to the panel, an electron gun inserted into a neck of the funnel, a video unit coupled with the electron gun for transmitting a video signal, and first and second clamps respectively coupled with the electron gun and the video unit for preventing the video unit from separating from the electron gun. With this configuration, the video unit is easily combined to the electron gun and prevented from separating from the electron gun.

Display apparatus with a combined structure of electron gun and video unit

A monitor with an easily attachable and detachable bottom shield. The monitor comprises a front case, a cathode ray tube installed at a rear part of the front case, and a pair of snap members protruding from the front case. The monitor also has a pair of supporting members supporting the cathode ray tube thereon. A pair of guide rails protrude from the rear side of the front case. The bottom shield comprises a bracket with through holes formed at predetermined locations for receiving the snap members. Protruding ribs are formed on the bottom shield and slide on the guide rails when assembling the monitor.

Monitor comprising snap engaging bottom shield

A heat sink assembly adapted to mount on a printed circuit board for dissipating heat from a heat generating component of an electronic device. The heat sink assembly includes a base extended upwardly from the printed circuit board, and having a heat conducting surface for conducting heat, and a heat radiating surface opposite of said heat conducting surface for radiating heat from the heat conducting surface; at least one heat generating component positioned in contact with the heat conducting surface of the base; a fastening clip for clamping the heat generating component in contact with the heat conducting surface of the base; a plurality of cooling fins extended from the heat radiating surface of the base at predetermined intervals for dissipating the heat conducted through the heat conducting surface of the base and generated from the heat generating component; and support members extended at opposite ends of the base for protecting the heat generating component and supporting the mounting of said heat sink assembly on the printed circuit board.

Growing community of inventors

Suwon, South Korea

Wan-Sub Lee