Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Fu Zhun Precision Ind. (shenzhen) Co., Ltd.

Wan-Lin Xia

Tao Li

Min-Qi Xiao

Hsieh-Kun Lee

Yong Zhong

Bo-Yong Yang

Bao-Chun Chen

Jun Long

Hsieh Kun Lee

Ji-Yun Qin

Wei-Qiang Tian

Jin-Song Feng

Neng-Bin Li

He-Ben Liu

Wei Chen

Xue-Wen Peng

A fastener, for assembling a fan to a bracket, includes a shaft, and an expanding head extending from an end of the shaft. The shaft has a bulge formed at an opposite end thereof. A handle extends from the bulge of the shaft. The handle is used for facilitating an operator to manipulate the fastener to secure the fan and the bracket together. By pulling the handle of the fastener, the shaft of the fastener extends through the fan and the bracket to reach a position where the head and the bulge of the shaft of the fastener tightly sandwich the fan and the bracket therebetween.

Fan fastener for fastening a fan to a heat sink and method of using the same

A heat sink with heat pipes includes a base (). The base includes a bottom surface contacting a heat-generating component (), an upper surface opposite to the bottom surface, and a plurality of grooves () defined on the upper surface of the base. The heat sink further includes two heat pipes () received in the grooves, each heat pipe comprising an evaporating section () and a condensing section () respectively, wherein the evaporating sections of the heat pipes are closely arranged on a portion of the base, and wherein the condensing sections of the heat pipes spread out from said portion of the base by extending in the grooves to other parts of the base so that heat absorbed by the base from the heat-generating component can be evenly spread to the whole base.

Heat sink with heat pipes

A heat sink includes a base () and heat pipes (). The base includes a bottom surface contacting with a heat-generating electronic component (), an upper surface defining grooves () receiving the heat pipes therein. Evaporating sections () of the heat pipes are located near a first end portion () and condensing sections () of the heat pipes are located near a second end portion () of the base. A first fin assembly () is mounted on the upper surface and a second fin assembly () is mounted on the bottom surface of the base near the second end portion thereof. A fan () is located near the second end portion of the base.

A heat pipe type heat dissipation device for an electronic component comprises a base plate, a cover plate spaced from the base plate, a plurality of parallel fins extending between the base plate and the cover plate and connecting with them. The base plate, the cover plate and each two adjacent fins collectively define a unitary air passage. The base plate has a protuberant portion, which has a convex surface facing towards the cover plate and has a thickness getting small from the middle to two sides in a direction parallel to the fins. The cover plate also has a protuberant portion similar to the protuberant portion of the base plate. A heat pipe connects the protuberant portions of the cover plate and the base plate.

Heat pipe type heat dissipation device

A heat sink assembly includes a heat sink (), a fan cover () mounted on the heat sink and a fan () carried by the fan cover. The heat sink comprises a base () and a plurality of spaced heat dissipation fins () extending from the base. The spaced heat dissipation fins define a plurality of channels () extending through front and rear ends of the heat sink. A cavity () is formed between the front end of the heat sink and the fan cover. The front end of the heat sink is configured with an arced front edge or an inclined front edge.

Heat sink assembly

A heat dissipation device includes a plurality of first, second and third fins arranged side by side and a fan. The fins define a plurality of parallel channels therein respectively for air flowing therethrough. The fan and the channels of the first fins corporately define an enhanced airflow path which is isolated from the channels of the second and third fins so that the fan entirely impels an airflow generated by the fan to pass through the channels of the first fins. The first fins are located corresponding to a portion of a bottom surface of a base for contacting with a heat-generating electronic component.

Hybrid heat dissipation device

A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module for contacting with the heat-generating component. The base includes a plurality of first walls and a plurality of second walls. The sidewalls of the retention module enclose a periphery of the base, and the first walls and the second walls respectively abut against the sidewalls of the retention module when the base is located at a first position and a second position. A rotation of the base from the first position to the second position reduces an adhering force generated by a thermal grease located between the base and the heat-generating component.

Heat dissipation device

A heat dissipation device comprises a heat spreader for contacting an electronic device for absorbing heat therefrom. A plurality of fins is formed on the heat spreader. A first heat sink is separated from the heat spreader and comprises a first base substantially perpendicular to the heat spreader and a plurality of first fins formed on the first base. A second heat sink comprises a second base connecting with the first base and a plurality of second fins formed on the second base. Two heat pipes connect the heat spreader with the first base and the second base via opposite sides of the heat dissipation device. The heat pipes are partly sandwiched between the first base and the second base and transfers heat from the heat spreader to both of the first and the second heat sink.

A heat dissipation device includes a heat sink defining a pair of cutouts at two opposite sides thereof. The heat sink includes two pads fixed in the cutouts, respectively. Each pad defines a slot therein. A retention module supports the heat sink thereon, and extends a pair of clamping arms in the cutouts of the heat sink. Each clamping arm defines a slit. A clip includes two abutting portions rotatablely connecting with the pads and the clamping arms, and two pressing portions slidably received in the slots of the pads and the slits of the clamping arms. When the clip is moved to a locked position, the pressing portions of the clip press the pads downwardly a distance relative to the clamping arms so that the heat sink can have an intimate contact with an electronic device.

A heat dissipation assembly comprises a mounting seat, a heat sink and a clip for fastening the heat sink in the mounting seat. The mounting seat defines an opening and is provided with a first and second protrusions. The heat sink is accommodated in the opening of the mounting seat. The clip comprises an elongated pressing member for pressing the heat sink and a clamping leg connected to one end of the pressing member and attached to the first protrusion of the mounting seat. An operating member, defining a notch, is pivotably attached to the other end of the pressing member and is rotatable relative to the pressing member and the second protrusion of the mounting seat slides in the notch of the operating member so that the clip switches between a release status and locking status.

Clip and heat dissipation assembly using the same

A heat dissipation device includes a heat sink including a heat conducting portion and a plurality of fins extending from the heat conducting portion. The heat conducting portion has a base portion for contacting a heat generating device, and two wing portions extending from the base portion. The heat sink has two slits extending through two opposite sides thereof. A fan holder having a fan mounted thereon is attached to a face of the heat sink. The fan holder includes two brackets each having a rib engaged in a corresponding slit of the heat sink to thereby attach the fan holder to the heat sink, and a faceplate having the fan thereon. The faceplate has an ear secured to a corresponding wing portion of the heat sink by a screw and a tab extending upwardly beyond a top end of the heat sink.

Heat dissipation device having a fan holder for attachment of a fan

A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at two sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The heat sink defines a slot at a side thereof, the guiding member extends at least a fixing arm fixed to the heat sink and a tongue embedded into the slot of the heat sink, thereby attaching the guiding member to the heat sink.

A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.

Heat sink

A heat sink () for a portable computer () includes a plurality of fins () located external to the portable computer, a conducting plate () extending into an inner space of the portable computer for absorbing heat in the portable computer, and a heat pipe () transferring the heat absorbed by the conducting plate to the fins. Therefore, the heat in the portable computer is removed from the inner space of the portable computer by the heat sink.

Heat sink for a portable computer

A heat dissipating device of the present invention includes a heat sink () and two locking devices () for securing the heat sink. The heat sink includes a base () for contacting an electronic component. Each locking device includes a spring member, a post () and a sleeve (). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.

Growing community of inventors

Shenzhen, China

Wan-Lin Xia