Cheil Industries Inc.

Wan Jung Kim

Su Mi Im

Yong Woo Hong

Chang Beom Chung

Ki Sung Jung

Sang Jin Kim

Chul Ho Jeong

Kyoung Jin Ha

Chang Bum Chung

Ah Ram Pyun

Ki Seong Jung

A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200&#xb0; C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.

Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same

An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.

Adhesive film composition, associated dicing die bonding film, die package, and associated methods

An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.

Adhesive film composition, associated dicing die bonding film, and die package

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Wan Jung Kim