Lg Innotek Co., Ltd.

Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Postech Academy-industry Foundation

Electronics and Telecommunications Research Institute

Snu Rdb Foundation

Lg Innotekco., Ltd.

Korea Photonics Technology Institute

Wan Ho Kim

Jun Seok Park

Seunghyun Oh

Jiseon Paek

Youngsea Cho

Hyung Rai Oh

Shin Hyoung Kim

Yeonho Kim

Jaehoon Lee

Kyungha Kim

Tal Chol Kim

Yong Gyu Lim

Daechul Jeong

Barosaim Sung

Yeongil Choi

Hwang Jun Song

Hyun Chul Joo

Jin Woo Hong

Min Sung Kim

Jung Park

Hee Seok Kim

Seung Hyun Oh

Jong Soo Lim

Seung Jin Kim

Jang Mi Lee

Young Geun Jun

Kyung Ha Kim

Seong Deok Hwang

Hwangjun Song

Eui Cheol Chung

Jae Pil Kim

Bung Chul Rim

Hyunchul Joo

Hyung Seuk Oh

Sang Bin Song

Byung Ki Han

Dai-Boong Lee

Ki Ung Jung

Dong Hyeok Ho

Oh Chan Kwon

Dong Hyuck Kam

Sie Wook Jeon

Dong Ju Lee

Provided are an analog-to-digital converter and/or an operating method thereof. The analog-to-digital converter includes a sample/hold circuit, a digital-to-analog converter, a comparing circuit, and a control logic circuit, wherein the digital-to-analog converter includes a first capacitor connected to a first comparison node and a first filtering node, a first reference voltage switch connected to the first filtering node and connected to a first delivery node or a first transmission node, a first pre-charge switch connected to the first filtering node or the first delivery node, and a first pre-charge capacitor connected to the first pre-charge switch and a ground voltage.

Analog-digital converter and operating method thereof

A digital radio frequency (RF) transmitter including processing circuitry configured to generate first through third pattern signals based on a pattern of an inphase (I)-quadrature (Q) binary data pair and a pattern of an inverted I-Q binary data pair, the first through third pattern signals having a same pattern and different phases, and a switched-capacitor digital-to-analog converter (SC-DAC) configured to remove an n-th harmonic component of an RF analog signal by amplifying the first through third pattern signals to have a certain magnitude ratio and synthesizing the amplified first through third pattern signals into the RF analog signal, where 'n' is an integer of at least 3, may be provided.

Digital radio frequency transmitter and wireless communication device including the same

A comparator configured to calibrate an offset according to a control signal, including an input circuit configured to receive a first input signal and a second input signal, and to generate a first internal signal corresponding to the first input signal and a second internal signal corresponding to the second input signal; a differential amplification circuit configured to consume a supply current flowing from a positive voltage node having a positive supply voltage to a negative voltage node having a negative supply voltage, and to generate an output signal by amplifying a difference between the first internal signal and the second internal signal; and a current valve configured to adjust at least a portion of the supply current based on the control signal.

Comparator providing offset calibration and integrated circuit including comparator

A radio frequency (RF) transmitter including a switched-capacitor digital-to-analog converter (SC-DAC) configured to selectively generate a first RF output signal having a first output power control range or a second RF output signal having a second output power control range from input signals received through a plurality of lines may be provided.

Radio frequency transmitter capable of selecting output power control range and wireless communication device including the same

A semiconductor device and a method for controlling amplitude of signal in the semiconductor device are provided. The semiconductor device comprises a signal generator configured to output a sinewave, a comparator configured to compare a magnitude of the sinewave with a magnitude of a reference signal at a first timing corresponding to a timing control signal and to output a comparison result, and a control signal adjustor configured to adjust one of the current control signal and a timing control signal depending on the comparison result of the comparator.

Semiconductor device and method for controlling amplitude of signal in the semiconductor device

A purge control method of the present disclosure includes determining whether or not a vehicle quickly decelerates in a driving situation in which a large amount of fuel evaporation gas is discharged, decreasing purge duty for operating a purge control solenoid valve when the controller determines that the vehicle is in a state of quick deceleration, and decreasing a purge flow of the fuel evaporation gas by controlling operation of the purge control solenoid valve by the purge duty.

Method of controlling purge of fuel evaporation gas

A power transmission apparatus of a hybrid electric vehicle may include an input shaft receiving an engine torque output from an engine, an output shaft disposed at a same axis with the input shaft and outputting a shifted torque, first and second motor/generators, a first shifting section including a first planetary gear set, outputting a rotation speed from the input shaft as inputted or increased, or forming an adjusted torque from the engine torque and torques of the first and second motor/generators, and outputting the adjusted torque, and a second shifting section including a compound planetary gear set formed as a combination of second and third planetary gear sets and outputting a shifted torque at least three stages from a torque received from the first shifting section to the output shaft.

Power transmission system of hybrid electric vehicle

A light emitting device including a package body having a first cavity; an electrode having a first electrode and a second electrode in the package body; at least one light emitting chip on the first electrode; a resin material in the first cavity; and a lens on the package body and the at least one light emitting chip. Further, the first electrode and the second electrode are separated by the package body, the package body comprises a first stepped portion exposed between the first electrode and the second electrode, the first electrode comprises a second cavity, and the at least one light emitting chip is disposed on the second cavity of the first electrode.

Light emitting device package

A power transmission apparatus of a hybrid electric vehicle may include an input shaft receiving an engine torque, an output shaft disposed at a same axis with the input shaft and outputting a shifted torque, first and second motor/generators, a first shifting section including a compound planetary gear set formed as a combination of first and second planetary gear sets, forming an adjusted torque from the engine torque received through two paths and torques of the first and second motor/generators, and outputting the adjusted torque, and a second shifting section including a third planetary gear set and outputting a shifted torque of two stages from a torque received from the first shifting section to the output shaft.

Power transmission apparatus of a hybrid electric vehicle

A light emitting device can include a substrate including a top surface, an outermost side surface, and a bottom surface; a light emitting diode chip on the top surface of the substrate; a reflecting member disposed on a first portion of the top surface of the substrate and the reflecting member having a cavity; a first metal layer disposed on a second portion of the top surface, one side of the outermost side surface, and a first portion of the bottom surface; a second metal layer disposed on a third portion of the top surface, another side of the outermost side surface, and a second portion of the bottom surface; a heatsink disposed on the bottom surface of the substrate; and at least two heatsink holes in the substrate formed to pass through the substrate, in which the at least two heatsink holes are in contact with the heatsink, and a reflective material is on an inside surface of the at least two heatsink holes, the first metal layer, the second metal layer, and the heatsink are separated from each other on the bottom surface of the substrate, and the at least two heatsink holes are vertically overlapped with the light emitting diode chip and the heatsink.

Light emitting diode package having frame with bottom surface having two surfaces different in height

A vehicle parking apparatus may include a parking rod having a first end portion connected to a detent plate and a second end portion on which a cam is placed, the parking rod rectilinearly moving in accordance with rotation of the detent plate and causing the cam to rotate a sprag about a rotation shaft; and a 'U'-shaped stopper extending from the second end portion of the parking rod and operating to surround or release the sprag in accordance with the motion of the parking rod, the stopper allowing rotation of the sprag by releasing the sprag when the detent plate is rotated to a P range position and preventing the rotation of the sprag by surrounding the sprag when the detent plate is rotated to a certain range position other than the P range position.

Parking apparatus for vehicle

A light emitting diode package can include a substrate; a light emitting diode on the substrate; an electrode electrically connected to the light emitting diode; a frame surrounding the light emitting diode and configured to reflect light emitted from the light emitting diode; and a hole formed to pass through the substrate and configured to connect both upper and bottom surfaces of the substrate, in which a top surface of the frame is higher than a top surface of the light emitting diode, a portion of the frame has an inclined inner surface, the frame includes at least one protruding portion protruding from an imaginary surface where the light emitting diode is disposed, a bottom surface of the at least one protruding portion contacts the substrate, the at least one protruding portion is outside of the light emitting diode, and the hole is vertically overlapped with the light emitting diode.

A light emitting device package is provided. The light emitting device package includes a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Light-emitting device package including lead frame and using lead terminal as a reflective cavity

A method of manufacturing a semiconductor device package includes: forming a based frame provided with an outer frame, a plurality of unit frames spaced apart from the outer frame by separating grooves interposed therebetween, and a first connector and a second connector forming connections between each of the plurality of unit frames and the outer frame; forming a package body in each of the plurality of unit frames to allow a mounting area of each unit frame to be open; removing one of the first connector and second the connector connected to each unit frame; mounting a semiconductor device in the mounting area of the unit frame; and cutting the other of the first connector and second the connector connected to each unit frame and separating, from the base frame, the unit frame in which the package body is formed.

Method of manufacturing semiconductor device package

Growing community of inventors

Gwangju, South Korea

Wan Ho Kim