Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Waltraud Hell

Martin Richter

Martin Wackerle

Yuecel Congar

Erwin Yacoub-George

Klaus Heinrich

A foil-based package and a method for manufacturing a foil-based package includes, among other things, a first and a second foil substrate. An electronic component is arranged between the two foil substrates in a sandwich-like manner. Due to the component thickness, there is a distance difference between the two foil substrates between the mounting area of the component and ears outside of the mounting area. The foil-based package and the method provides means for reducing and/or compensating a distance difference between the first foil substrate and the second foil substrate caused by the component thickness.

Foil-based package with distance compensation

The invention relates to a pump having a piezo diaphragm transducer arranged at a pump body of the pump, and to a method for producing a pump, wherein a piezo diaphragm transducer is mounted to a pump body, wherein the method, among other things, has providing a piezoceramic layer. In accordance with the invention, at least one piezo element is diced from the piezoceramic layer so that the at least one piezo element has a regular polygon shape having at least six corners. In addition, the method has forming the piezo diaphragm transducer by mounting the piezo element to a pump diaphragm.

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Munich, Germany

Waltraud Hell