Robert Boschgmbh

Walter Wagenbrenner

Thomas Wiesa

Ralph Schimitzek

Matthias Lausmann

Jens Nowotnick

Ulrich Warmbold

Sven Heinemann

Holger Gebhardt

Bernhard Klante

The invention relates to a printed circuit board (), with conductor tracks (), which are arranged at least on a surface of the printed circuit board () and serve for the electrical contacting of components, and with at least one testing zone (), which is formed by a portion of the conductor track () and serves for the electrical contacting of a testing element (), in particular a testing head, wherein the surface of the printed circuit board () is provided with a protective layer (), which is formed in the testing zone () such that it is interrupted in the region of a contact zone (), and wherein the contact zone () is provided with a layer (), which establishes an electrical contacting of the testing element () with the layer (). According to the invention, it is provided that the contact zone () is arranged at least partially at a lateral distance from the edges of the conductor track () in the region of the testing zone ().

Printed circuit board, method of producing a printed circuit board and testing device for testing a printed circuit board

In a method for manufacturing a composite arrangement, at least one printed circuit board substrate is joined with a support under the influence of an applied pressure exerted by a press die over a weave layer (prepreg) impregnated with resin, such that the resin in the region of an opening of the printed circuit board substrate does not flow into this opening. The applied pressure is, therefore, at least partially reduced in the region of the opening of the printed circuit board substrate.

Method for manufacturing a composite arrangement

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Tamm, Germany

Walter Wagenbrenner