Siemens Aktiengesellschaft

Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh & Co. Kg

Walter Springmann

Herbert Schwarzbauer

Jochen Mahlein

Manfred Bruckmann

Reinhold Spanke

Eckhard Wolfgang

Karl-Heinz Sommer

Gyoergy Papp

Peter Zwanziger

Gerhard Schulze

Nine bidirectionally blocking power components are attached on a substrate in the form of a three-row matrix. The power components are attached between three respective current conductors arranged parallel to each other above and below the power components. The current conductors above the matrix proceed at a right angle relative to the current conductors under the matrix. The interconnects to the gate and auxiliary emitter terminals are situated on or in a thin insulating printed circuit board or film and are secured to the corresponding contacts of the chips in recesses of the current conductors.

Matrix converter

An overvoltage protection apparatus for a matrix converter has nine bidirectional power switches which are arranged in a 3&times;3 switch matrix. The overvoltage protection apparatus has three varistors on both the network side and the load side, which are each connected, in delta, to input and output connections of the matrix converter. A result, the overvoltage protection apparatus has considerably reduced physical volume, as a result of which the component costs for the overvoltage protection apparatus are very low.

Overvoltage protection apparatus for a matrix converter

The present invention relates to an active overvoltage protection apparatus for a bidirectional power switch which has two back-to-back in series connected semiconductor switches in the &ldquo;common collector mode&rdquo; topology. The overvoltage protection apparatus has a diode network which is linked to gate and emitter connections of the bidirectional power switch in the in such a manner as to provide a voltage clamping circuit for each of the semiconductor switches in the bidirectional power switch.

Active overvoltage protection apparatus for a bidirectional power switch in common collector mode

A plurality of semiconductor arrangements arranged on interconnects are cected parallel to one another in a module. The arrangements lie opposite one another in pairs. At least one pair and at most two pairs of semiconductor arrangements are arranged to follow one another in the direction of an axis of the module and are further connected to lead conductors. Positions of the lead conductors with respect to the contacted semiconductor arrangements are the same for each pair of semiconductor arrangements or, respectively, two respective pairs of semiconductor arrangements. Corresponding lead conductors are connected to one another above the interconnects.

Power semiconductor module having a plurality of semiconductor

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Adelsdorf, Germany

Walter Springmann