Dyconex Patente Ag

Plantcare Ag

Dyconex Ag

Other

Diagnoswiss S.a.

Dyconex Pantente Ag

Walter Schmidt

Marco Martinelli

Yucel Toprak

Heinrich Meyer

Frédéric Reymond

Wolfgang Scheel

Joel Stephane Rossier

Alexandra S Frei

G&uuml;nter R&ouml;hrs

Frank Rudolf

Joël S Rossier

Ewald Losert

Theis Zur Nieden

Hermann Schmid

Hans-J&uuml;rg Barte

Yücel Toprak

The invention relates to a method for the automatic irrigation of plants, wherein the temporal progression of soil moisture is determined from measured soil moisture values, and said progression is used for the calculation of an optimized irrigation time duration, such that both water excess in the soil and soil drying are avoided as much as possible. Preferably, the time duration of irrigation is constantly evaluated and optimized using comparisons of measured values with prespecified moisture- and dryness threshold values (GWmoist, GWdry), and automatically adjusted to changing environmental conditions and/or plant requirements.

Method and apparatus for the automatic regulation of the irrigation of plants

A mobile apparatus and a process for adequately irrigating soil, wherein the apparatus has an irrigation unit for irrigating soil and a mobile microwave measurement unit for determining the water content of the soil along a measurement path. A control unit is used to irrigate the soil along the measurement path depending on the measured water content. The apparatus preferably also has a water tank and leaves an area of soil to be irrigated autonomously.

Process and apparatus for adequately irrigating soil

A method for the automatic irrigation of plants, wherein the temporal progression of soil moisture is determined from measured soil moisture values, and said progression is used for the calculation of an optimized irrigation time duration, such that both water excess in the soil and soil drying are avoided as much as possible. Preferably, the time duration of irrigation is constantly evaluated and optimized using comparisons of measured values with prespecified moisture- and dryness threshold values (GWmoist, GWdry), and automatically adjusted to changing environmental conditions and/or plant requirements.

The invention relates to a method and device for determining the water content of a medium, particularly of soils and the like, in which a probe or sensor () located in the medium is heated. A temporary change in temperature is effected by dissipating the thermal energy through the moisture in the area surrounding the probe, this change in temperature being used for determining the moisture content of the medium. An intermediate layer () is placed between the probe and the surrounding medium and is absorbent and mechanically deformable for mechanically coupling the probe to the surrounding medium and for decoupling the probe and the surrounding medium thereby enabling a precise measurement of moisture content to ensue while being subjected to the least possible thermal influence by the largely undetermined surrounding medium.

Device for measuring thermal properties in a medium and method for determining the moisture content in the medium

The technology is based on the anisotropic plasma etching of organic polymer sheets partially protected by a metallic mask. The originality of the process is to pattern the surface properties by the same physical means as the one used for the three dimensional fabrication and simultaneously to this fabrication. Surface properties means, but are not limited to hydrophobicity, hydrophilicity, conductivity, reflectability, rugosity and more precisely the chemical and/or physical state of the surface. It is also possible to generate the desired fonctionalities, for instance carboxylic acid, ester, ether, amid or imid, during the etching process. The patterning of the different properties may be achieved by two different techniques that may be used separately or simultaneously.

Method for fabricating micro-structures with various surface properties in multi-layer body by plasma etching

A method for manufacturing electrical connecting elements or semifinished products. Microvias are formed in a dielectric substrate layer by piercing a substrate layer () through a first conducting layer (), which essentially covers an entire side of the substrate. The perforation depth (d) is at least equal to the total thickness of the substrate and the first conducting layer. The conductor material of the first conducting layer (), during the piercing step, is deformed so that it partially covers the wall of the hole fabricated by the piercing process. Plating the first conducting layer with additional conductor material bridges the little remaining distance between the conductor material and the opposite side of the substrate layer.

Method for fabricating electrical connecting element

The invention concerns methods for the production of micro-holes in semi-finished components ( ) for printed circuit boards ( ), consisting of several layers of electrically conductive materials ( ) and dielectric materials ( ), wherein micro-holes are embossed into dielectric materials and/or electrically conductive materials and that the embossed micro-holes are subsequently cleaned by means of plasma or by means of wet-chemical processes

Method for producing micro-openings

A method for the manufacture of screened or shielded interconnecting conductors ( ) begins with semifinished foil products (H H H ), a first semifinished foil product (H ) having at least one layer of conductors ( &prime;) including signal conductors ( &prime;) and shielding conductors ( &prime;). Another semifinished foil product (H H ) has shielding material ( ), which is joined by a dielectric ( ) to at least one layer of conductors ( &prime;), in which the shielding material ( ) is provided by photochemical structuring near the shielding conductors ( &prime;) with openings ( &prime;) extending to the dielectric ( ). The dielectric ( ) is removed in accordance with the openings ( ) extending to the shielding conductors ( &prime;) and by means of the openings ( &prime;) the shielding material ( ) is electrically contacted with the shielding conductors ( &prime;) so that signal conductors ( &prime;) are insulated by dielectric ( ) and shielded by shielding conductors ( &prime;) which are electrically connected to the shielding material ( ).

Process for producing connecting conductors

The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (,), power supplying substrate parts (,), mechanical substrate parts (,), as well as the arrangement of components (,) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (,), components (,) and mechanical stiffening elements (,) has the following structure. The substrate parts with the fine, dense and flexible elements are associated with the inner areas of the overall circuit, the substrate parts with the rigid elements and/or components are associated with the outer areas of the overall circuit and a stiffening support material is so placed in the outer area that the circuit is given a mechanical support structure, which is designed in locally rigid manner passing into flexible areas. The overall circuit is folded and/or wound corresponding to the rigid and flexible portions. The mechanical support structure can be formed by separately produced apparatus housing parts or by the apparatus housing.

Connection substrate

A method for producing a foil circuit board including a plurality of flexible electrically non-conductive and flexible conductive layers, which are laminated together. The non-conductive layers are positioned between the conductive layers and two of the conductive layers are the outermost surface layers of the foil circuit board. The circuit board includes flexible areas and rigid areas, and the flexible areas are provided by etching the board to remove at least part of one of the outermost surface layers and an adjacent underlying non-conductive layer.

Method for producing foil circuit boards

A method for the manufacture of printed circuit boards, foil circuit boards and semifinished products for printed and foil circuit boards formed from preliminary products with electrically conductive coatings (,) structurable to conductor patterns and structurable substrates (,), for the formation of connectors (V), contours (K) and conductor patterns (L), the connectors (V), contours (K) and conductor patterns (L) being structured simultaneously or in the same method steps from the preliminary products, and the connectors (V) and contours (K) are part of the structured preliminary product substrate, the connectors (V) being brought for electrical or mechanical connection into a position in which they are connectable and the finished conductor patterns (L) can be separated at contours (K).

Foil circuit boards and semifinished products and method for the manufacture thereof

Insulating foil circuit board with rigid and flexible sections

A process for structuring polymer films, such as printed circuit boards and film boards, uses a plasma, which is formed in a container by the excitation of gas mixtures by microwaves, in which there is a control of the surface temperature of the polymer films during structuring by the plasma. By adjusting the parameters it is possible to operate just below a material-damaging temperature limit for polymer films, so that structures or microshapes are carefully plasma-eroded in polymer films. At high surface temperatures and with a dense plasma, structures or microshapes are rapidly eroded by the plasma, in which the structures or microshapes are homogeneously plasma-eroded with a uniform distribution of the surface temperature and gas flow. The surface temperature is maintained below the material-damaging temperature by controlling the power density of the microwave energy, the level of energy provided to a heater in the container, and the pressure of gas in the container in accordance with a time pattern algorithm using a computer.

Process for structuring polymer films

A multilayer laminated body has a determinate system of hollow passages and is formed by an assembly of flat layers of polymeric materials having major dimensions in orthogonal X and Y directions and a thickness dimension in a Z direction perpendicular to the X and Y directions. Selected ones of the layers have openings extending through in the Z direction, and other layers have canals formed in an X-Y plane. The openings and canals form parts of hollow passages so that assembly of multiple layers joins openings and canals forms complete and continuous passages through the assembled layers. Layers joined in pre-laminate assemblies are assembled together in precise relative positions for desired alignment of the canals and openings. The passages can be filled with optically conductive material or electrically conductive material and electrodes can be appropriately positioned for acting on fluids passing through the body.

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Russikon, Switzerland

Walter Schmidt